WMSIC Electronic Components

TI CD4081BM96

ModelCD4081BM96
PackageSOIC-14
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) CD4081BM96
Type
TI
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
CD4081BM96
Electronic Component
1
Package
SOIC-14
Electronic Component
Logic Gate
Electronic Component
4000B
Electronic Component
0.264g
Electronic Component
1
Channel Count
4
Electronic Component
BM0000281826
Operating Temperature
55℃~+125℃
Operating Voltage
3V~18V
Logic Type
and Gate
Current(IOH)
3.4mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CD4081BM96

基本信息

CD4081BM96 是一款由德州仪器(Texas Instruments)公司制造的标准四通道与门集成电路,采用14-SOIC封装,专为各种数字电路应用设计。作为一款表面贴装型(SMD)逻辑芯片,该产品广泛应用于计算机、自动化控制,以及各种消费电子产品中。

关键特性

  • 逻辑电平范围:

    • 高电平(V_H):3.5V ~ 11V
    • 低电平(V_L):1.5V ~ 4V
    • 该电平范围使得该元件能够与多种逻辑电路兼容,适应不同的工作环境和电源电压。
  • 工作电压:

    • 本器件可在3V至18V的范围内供电,提供了极大的灵活性,更易于与现有系统集成。
  • 传播延迟:

    • 在15V、50pF负载条件下,CD4081BM96 的最大传播延迟为90ns,适合对速度要求不是特别高的应用场景。
  • 功耗特性:

    • 该芯片的静态电流仅为1µA,这使得其在低功耗应用中表现出色,有利于延长电池供电设备的使用寿命。
  • 输入与输出特性:

    • 输入数量为2个,支持多种输入组合以实现所需逻辑功能。
    • 输出电流能力同样为3.4mA(高和低),适用于直接驱动小型负载。
  • 工作温度:

    • 可在-55°C至125°C的广泛温度范围内工作,适合工业及其他恶劣工作环境中的应用。

应用领域

  1. 数字电路设计:

    • CD4081BM96可用于构建各种逻辑电路,包括数据选择器、加法器、计数器等。其四通道设计使得在同一封装内可以实现多个逻辑功能,减少了电路板的占用面积。
  2. 工业控制:

    • 由于其宽温工作范围及稳定性能,该与门集成电路非常适合用于工业自动化系统,如PLC(可编程逻辑控制器)、传感器接口及控制系统中。
  3. 消费电子产品:

    • 此元器件也广泛应用于家庭电子设备,如智能家居控制、音视频处理设备等,提升了设备的智能化水平。
  4. 通信设备:

    • 在通信平台中,CD4081BM96可以被用作信号调整、数据处理等功能模块,保证数据传输的准确性与稳定性。

封装和布局

CD4081BM96采用14-SOIC(小型外形标准集成电路封装),这种封装使得其在PCB板上所占据的空间较小,有助于实现高密度布线设计。其表面贴装的特性,使得在自动化生产过程中可大大提高装配效率,同时也减少了人力成本。

结论

CD4081BM96 是一款性能稳定、功耗低、兼容性强的四通道与门集成电路,适用于广泛的电子产品和工业控制系统。其灵活的工作电压范围、低静态电流和宽广工作温度范围,使得它在现代电子设计中成为理想的选择。 如果您正在寻找一款可靠的逻辑门IC,CD4081BM96无疑是一个值得推荐的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.