WMSIC Electronic Components

TI ESDS302DBVR

ModelESDS302DBVR
PackageSOT-23-5
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

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Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) ESDS302DBVR
Type
TI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
ESDS302DBVR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.065g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
2.3pF
Electronic Component
BM0227583466
Operating Temperature
40℃~+125℃
Voltage
6V
Electronic Component
IEC 61000-4-2;IEC 61000-4-4;IEC 61000-4-5

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESDS302DBVR 产品概述

一、产品简介

ESDS302DBVR 是 TI(德州仪器)推出的一款双路、双向瞬态电压抑制(TVS/ESD)二极管,封装为 SOT-23-5。该器件专为对接口信号线提供静电放电(ESD)和浪涌保护而设计,具有低结电容、低漏电和高脉冲吸收能力,适合保护低压高速数据接口与通用 I/O 端口。

二、主要参数与特点

  • 钳位电压(Vclamp):6 V(典型,受测试条件影响)
  • 工作温度:-40 ℃ 到 +125 ℃
  • 击穿电压(Vbr):7.5 V
  • 反向截止电压 Vrwm(工作电压):3.6 V(适合 ≤3.3 V 系统)
  • 峰值脉冲功率 Ppp:85 W @ 8/20 μs
  • 峰值脉冲电流 Ipp:12 A @ 8/20 μs
  • 结电容 Cj:约 2.3 pF(单通道)
  • 反向电流 Ir:约 50 nA(典型)
  • 通道数:双路(两路独立保护)
  • 极性:双向,支持信号双向传导
  • 防护等级:满足 IEC 61000-4-2(静电放电)、IEC 61000-4-4(脉冲群/快速瞬变)和 IEC 61000-4-5(浪涌)测试要求

这些参数决定了 ESDS302DBVR 在对 3.3V 及以下电平信号线进行快速瞬态抑制时具有良好的性能:低结电容有助于维持信号完整性,低漏电利于低功耗设计,高脉冲功率与较大的峰值脉冲电流保证了对短时高能量瞬态的吸收能力。

三、典型应用场景

  • 3.3 V 或更低电压的高速数据接口保护(如 GPIO、I²C、SPI、UART 等)
  • 手持设备和便携终端的外部接口(连接器侧近端)
  • 工业控制或通信设备中的低压信号线防护
  • 需要双路双向保护且占板面积要求严格的场合(SOT-23-5 小封装)

注意:由于 Vrwm=3.6 V,该器件更适用于 3.3 V 及以下接口;用于 5 V 总线时需评估漏电与夹断行为,或选择 Vrwm 更高的型号。

四、封装与 PCB 布局建议

  • 将器件尽量靠近受保护的外部连接器或接口放置,最短的走线能最大限度降低寄生感抗与延迟。
  • 保护二极管的地引脚应连接到低阻抗的参考地或平面,避免地环路;若板上有多个地,参考 TI 数据手册进行合适的接地策略。
  • 避免在保护器件与被保护信号之间布置过多的过孔或长走线,以减少寄生电感。
  • 对于高频敏感线路,2.3 pF 的结电容是相对较小的,但仍会产生一定的带宽影响,布局时应评估对信号完整性的具体影响并进行必要的仿真或示波器验证。

五、使用注意与选型建议

  • 在选型前请核对系统工作电压与 Vrwm(3.6 V)是否匹配;若保护对象为 5 V 总线(如 USB2.0 VBUS 等),建议选择 Vrwm 更高、专为 5 V 设计的 TVS 器件。
  • 器件的钳位电压(6 V)为典型测试条件下值,实际钳位受脉冲形状和路径寄生影响,设计时应留有裕量以保护后端电路元件。
  • 虽能满足 IEC 61000 系列测试,但在高能雷击或长持续浪涌场合,TVS 器件只能作为局部保护,系统级应结合浪涌抑制器、保险丝或隔离元件共同防护。
  • 参考 TI 官方数据手册获取详细引脚定义、典型电气特性测试条件及可靠性信息,必要时在目标应用上做 ESD/浪涌实验验证。

总结:ESDS302DBVR 以其双路、双向、低电容和高脉冲吸收能力,适合对 3.3 V 及以下高速数据线进行紧凑型的静电与瞬态浪涌保护。正确的 PCB 布局与对工作电压的匹配是发挥其性能的关键。有关引脚、典型波形和完整特性曲线,请参阅 TI 官方数据手册。

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