Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TI SN74LVC1T45DBVR
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) SN74LVC1T45DBVR
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- SN74LVC1T45DBVR
- Electronic Component
- 1
- Package
- SOT-23-6
- Electronic Component
- Converter / Level positions
- Electronic Component
- 0.057g
- Electronic Component
- 1
- Electronic Component
- 1
- Features
- Output
- Electronic Component
- BM0000001176
- Operating Temperature
- 40℃~+85℃
- Data
- 420Mbps
- Output Type
- Electronic Component
- Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SN74LVC1T45DBVR 产品概述
基本介绍
SN74LVC1T45DBVR是德州仪器（Texas Instruments）出品的一款高性能电压电平转换器，采用表面贴装型封装（SOT-23-6）。其设计旨在为不同电压等级的系统提供双向电压电平转换，适用于各种电子设备的连接以及信号兼容。
主要特点
电压范围：该器件的工作电压范围为1.65V至5.5V的宽电压支持，能够适应多种电源电平的应用环境。这使得SN74LVC1T45DBVR能够在不同的逻辑电平系统之间进行有效的数据传输。
数据速率：最高数据传输速率为420Mbps，这个速率非常适用于高速数据通信的应用，提供了快速且可靠的信号传输。这对于现代电子设备的性能至关重要。
通道类型：该器件具有双向通道特性，支持信号在任一方向的流动。这一特性使得SN74LVC1T45DBVR特别适用于双向数据传输的场合，如I2C、SPI和其他串行通信协议。
输出特性：器件的输出类型为三态且为非反相输出，意味着它能够在不需要使用其他外部电路的情况下直接与多个目标设备连接。
安装类型：采用SOT-23-6封装，提供了小型化以及良好的热性能，适合空间受限的应用。
工作温度：该器件的工作温度范围为-40°C至85°C，这确保了SN74LVC1T45DBVR可以在极端环境条件下稳定运行，符合广泛的工业和消费电子应用需求。
应用场景
SN74LVC1T45DBVR广泛应用于各种电子电路和设备中，尤其是在以下领域中具有显著的优势：
嵌入式系统：在不同电压级别的微控制器和传感器之间进行信号转换和兼容，保证数据的高效传输。
消费电子：如智能手机、平板电脑和其他便携式设备中，支持不同逻辑电平组件之间的互联。
汽车电子：在汽车电子系统中，尤其是传感器、舵机和控制单元间进行稳定的数据交互。
工业自动化：在自动化设备中，连接PLC与各种外围设备，实现数据采集与控制。
通信设备：在网络路由器和交换机等设备中，确保不同数据总线之间的兼容性。
结论
SN74LVC1T45DBVR是一款高效、可灵活应用的双向电压电平转换器，具备多种优异的性能参数，包括宽电压范围、高数据速率以及双向操作能力。它的设计使其在各种电子应用中均具备良好的兼容性和可靠性，成为连接不同电压等级电子组件的理想选择。这些性能使其在现代电子设备和系统中扮演着重要的角色，为电路设计师提供了极大的便利。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
