Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TI CD4013BM96
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) CD4013BM96
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- positionsand positions
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- CD4013BM96
- Electronic Component
- 1
- Package
- SOIC-14
- Type
- D
- Electronic Component
- Flip-Flop
- Electronic Component
- 4000B
- Electronic Component
- 0.264g
- Electronic Component
- 2
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Latching
- 2ns
- Electronic Component
- BM0093065322
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CD4013BM96 产品概述
概述
CD4013BM96 是德州仪器（Texas Instruments）出品的一款双D触发器，封装采用14-SOIC，广泛应用于数字电路设计中。它的主要功能是实现数据的设置（预设）和复位，这使得它在多种应用中成为关键的零件。作为一种高性能的逻辑元件，CD4013BM96 可以在极广的电压范围和温度范围内稳定工作，满足现代电子设备对高可靠性的要求。
主要特性
输入与输出特性: CD4013BM96 是双D触发器，每个触发器都具有一个输入和一个输出，且其输出类型为差分。这种设计能够有效减少信号干扰，使输出更稳定。
工作电压与电流: 该触发器的供电电压范围在3V至18V之间，这意味着它可以兼容多种典型数字电路的电源需求。静态电流（Iq）为4µA，极低的静态功耗使其适用于对低功耗有严格要求的应用场合。
速度与性能: CD4013BM96 的最高时钟频率为24MHz，适合高速逻辑应用。其在不同电压和最大负载电容（CL）条件下的最大传播延迟为90ns（@ 15V, 50pF），这使得该元件能够满足大多数数字系统对传输速度的要求。正边沿触发的设计确保了数据能够在时钟边沿的上升阶段正确采样和传递。
输入特性: 该触发器的输入电容为5pF，这一特性使得它对于输入信号的响应快速且准确，适合于复杂信号的处理。
温度范围: CD4013BM96 的工作温度范围为-55°C至125°C，能够在极端气候条件下稳定工作，适合航空航天、汽车等对环境适应性要求极高的应用。
应用场景
CD4013BM96 广泛应用于如下场景：
- 计数器与分频器电路: 可以使用 CD4013BM96 作为时钟信号的捕获器和分频器，帮助构建可靠的计数器电路。
- 数据存储缓冲: 在需要暂存数据和缓冲信号的场合，例如音频处理、数据采集等，CD4013BM96 可以作为有效的数据存储元件。
- 状态机设计: 可用于实现有限状态机的控制，处理各种合成和控制逻辑的复杂需求。
- 时序电路: 适用于时序电路的设计，可以帮助构建触发事件顺序执行的逻辑电路。
安装与封装
CD4013BM96 采用表面贴装型（SMD）设计，符合现代电子设备的小型化要求。其14-SOIC封装（0.154"宽，3.90mm宽）便于集成在紧凑的电路板中，方便制造和安装。
总结
作为一款高效、灵活且具有高可靠性的D触发器，CD4013BM96 在现代电子应用中占有重要的地位。广泛的电压范围、低功耗设计、以及良好的响应时间使其成为电子工程师在设计数字电路时的重要选择。无论是在工业自动化、消费电子、还是在特殊应用领域，CD4013BM96 都能够提供出色的性能和稳定性，是实现高品质电子产品的理想组件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
