WMSIC Electronic Components

TI SN74AHC1G08DCKR

ModelSN74AHC1G08DCKR
PackageSC-70-5
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) SN74AHC1G08DCKR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74AHC1G08DCKR
Electronic Component
1
Package
SC-70-5
Electronic Component
Logic Gate
Electronic Component
74AHC
Electronic Component
0.033g
Electronic Component
1
Channel Count
1
Features
Electronic Component
Electronic Component
BM69413942
Operating Temperature
55℃~+125℃
Operating Voltage
2V~5.5V
Logic Type
and Gate

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74AHC1G08DCKR 产品概述

一、概述

SN74AHC1G08DCKR 是德州仪器(Texas Instruments, TI)推出的一款高性能 CMOS 与门逻辑集成电路(IC),其采用 SC-70-5 封装,专为表面贴装(SMD)应用设计。这款 IC 具有出色的兼容性和灵活性,广泛应用于各种数字电路中,如控制逻辑、信号处理和数据路径接口。

二、主要特点

  1. 逻辑类型: 该 IC 属于与门类型,能够接受两个输入信号并在两个输入均为高电平的情况下输出高电平信号。

  2. 工作电压范围: SN74AHC1G08DCKR 的供电电压范围为 2V 至 5.5V,适应不同的电源需求,实现灵活的设计。

  3. 逻辑电平范围: 输入的逻辑电平被分为高电平(1.5V ~ 3.85V)和低电平(0.5V ~ 1.65V),确保在宽广的电压范围内,信号能够稳定地被识别。

  4. 最大传播延迟: 在 5V、50pF 负载条件下,该 IC 最大发播延迟为 7.9ns,确保数据的快速转换和精确处理,适合高速应用。

  5. 温度范围: SN74AHC1G08DCKR 的工作温度范围为 -55°C 至 125°C,具备良好的环境适应性,适合在极端条件下使用。

  6. 静态电流与输出电流能力: 最大静态电流仅为 1µA,确保在待机状态下功耗极低。同时,输出可以提供高达 8mA 的电流,满足驱动负载的需求。

  7. 单通道设计: IC 仅包含一个逻辑通道,适合需要低功耗和高稳定性的单功能电路设计。

三、应用场景

SN74AHC1G08DCKR 由于其优异的性能,广泛应用于众多领域,包括但不限于:

  • 消费电子产品: 诸如智能家居设备、音响系统、游戏主机等,对快速响应和节能有着较高要求的产品。
  • 工业控制: 在自动化系统中使用,与其他逻辑电路相结合,构建复杂的控制逻辑。
  • 通信设备: 在数据转换与处理线路中,作为处理逻辑的基础单元.
  • 汽车电子: 可用于监控传感器输出,控制信号的传递,提高数据处理效率。

四、封装和安装

SN74AHC1G08DCKR 采用 SC-70-5 封装,这是一种非常小巧且适合于移动设备的表面贴装型封装。SC-70 封装的优势在于其体积小、重量轻,使得电子设计可以在有限的空间内实现更多功能。同时,表面贴装技术(SMT)也提高了生产效率和组装的可靠性。

五、总结

总的来说,SN74AHC1G08DCKR 是一款高性能、低功耗的高科技 CMOS 与门 IC,适合多种数字电路应用。其宽广的工作电压、低静态电流、大输出能力以及适应极端环境的能力,使其在现代电子产品中备受青睐。利用该 IC,设计师可以轻松构建出高效、可靠的数字逻辑电路,推动产品性能的提升和创新。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.