WMSIC Electronic Components

TI TPS62A01ADRLR

ModelTPS62A01ADRLR
PackageSOT-563
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) TPS62A01ADRLR
Type
TI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
TPS62A01ADRLR
Electronic Component
1
Package
SOT-563
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.2g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0242402994
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.5V~5.5V
Switching Frequency
2.4MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPS62A01ADRLR 产品概述

一、产品简介

TPS62A01ADRLR 是德州仪器(TI)推出的一款单通道降压型开关稳压器,输入电压范围宽(2.5 V 至 5.5 V),输出电压可调(0.6 V 至 5.5 V),最大输出电流 1 A。器件采用降压拓扑并集成功率开关与同步整流,工作开关频率高达 2.4 MHz,封装为体积小巧的 SOT-563,适合空间受限的便携式与点负载应用。

二、主要规格

  • 功能类型:降压型(Buck)
  • 输入电压:2.5 V ~ 5.5 V
  • 输出电压:600 mV ~ 5.5 V(可调)
  • 输出电流:最大 1 A
  • 开关频率:2.4 MHz
  • 同步整流:内置(提高效率、降低外部肖特基需求)
  • 工作温度范围:-40 ℃ ~ +125 ℃ (TJ)
  • 封装:SOT-563

三、特色功能

  • 轻载高效运行:在轻载条件下保持较高转换效率,延长电池寿命。
  • 强制脉宽调制(Forced PWM)工作模式:提供固定频率、低噪声的开关特性,便于 EMI 管理与系统同步。
  • 过流保护与打嗝限流:在短路或过载时进入保护,自动限流并周期性恢复,增强系统鲁棒性。
  • 输出放电功能:关断时快速放电输出,提高系统上电/下电的确定性。
  • 工作状态指示:便于监控器件使能与工作状态(具体信号/引脚以器件手册为准)。

四、典型应用

适用于移动终端、便携式仪器、摄像模组、物联网节点、工业传感前端及任何需要从 3.3 V/5 V 总线向低电压数字负载供电且空间受限的场合。

五、设计与布局建议

  • 高频工作(2.4 MHz)允许使用小体积电感和电容,但同时对布局与 EMI 更敏感:输入电容尽量靠近器件 VIN 与 GND 引脚,开关节点回路尽量短。
  • 选用低 DCR 的贴片电感与低 ESR 输出电容以降低损耗并稳定环路。
  • SOT-563 封装需重视热路径:在 PCB 上为器件散热预留足够铜面积并优化铺铜,必要时于底层增加过孔改善散热。
  • 调试时参考 TI 提供的典型应用电路与元件清单,按推荐元件值验证环路稳定性与热性能。

六、封装与热管理

SOT-563 封装体积小、适合密集 PCB 布局,但热阻相对较高。长期大电流输出或高环境温度下应评估结温并采取铺铜散热或降低环境温度以确保器件在额定 TJ 范围内可靠工作。

备注:以上为基于器件主要参数的概述,具体引脚定义、外部元件取值、启动/禁用控制与电磁兼容建议请以 TPS62A01 的官方数据手册为准。

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