WMSIC Electronic Components

TI SN74LS08DR

ModelSN74LS08DR
PackageSOIC-14
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) SN74LS08DR
Type
TI
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LS08DR
Electronic Component
1
Package
SOIC-14
Electronic Component
Logic Gate
Electronic Component
74LS
Electronic Component
0.264g
Electronic Component
1
Channel Count
4
Electronic Component
BM69417647
Operating Temperature
0℃~+70℃
Operating Voltage
4.75V~5.25V
Logic Type
and Gate
Current(IOH)
400uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LS08DR 产品概述

概述

SN74LS08DR 是德州仪器(Texas Instruments)推出的一款四通道与门集成电路(IC),采用14-SOIC封装设计,适用于多种数字电路应用。与门是一种基础的逻辑电路元件,能够根据输入信号的状态输出相应的逻辑结果,广泛应用于计算机硬件、电信设备和工业自动化等领域。SN74LS08DR 的设计确保了高速度、低功耗以及良好的输入兼容性,使其成为现代电子设计中的理想选择。

主要参数

SN74LS08DR 具有以下关键电子参数:

  • 安装类型:表面贴装型,使得元件在电路板上的空间利用更加高效且便于自动化生产。
  • 逻辑电平:本器件的高逻辑电平为2V,低逻辑电平为0.8V,符合TTL(晶体管-晶体管逻辑)标准,确保了与其他逻辑电路的良好兼容性。
  • 供电电压:支持的电压范围为4.75V ~ 5.25V,适应于多种电源设计。
  • 最大传播延迟:在5V供电和15pF负载条件下,其最大传播延迟为20ns,使其能够快速反应,提高电路整体的工作效率。
  • 工作温度范围:该产品适合于0°C 到 70°C 的工作环境,适应于一般的工业和消费类电子产品。
  • 输入数与电路数:此器件包含4个与门,每个与门都有2个输入,极大地提升了电路设计的灵活性和扩展性。
  • 输出电流:电流输出高达400µA和8mA,使其能够驱动多种负载。

应用领域

SN74LS08DR 在众多电子应用中展现出了广泛的适用性,尤其是在以下领域:

  1. 计算机系统:在计算机逻辑电路中,SN74LS08DR 被广泛运用,比如算术逻辑单元(ALU)的逻辑运算部分。
  2. 信号处理:在信号处理系统中,可以用作数据选择、码转换等中间逻辑处理环节。
  3. 控制系统:在工业控制系统中,SN74LS08DR 可以用于执行各种逻辑控制任务,确保系统按照设定的逻辑状态操作。
  4. 数字电路设计:该器件可以作为设计数字时钟、计数器和其他时序逻辑电路的基础单元。

性能优势

SN74LS08DR 的主要优势体现在:

  • 高速操作:凭借其低传播延迟,该门电路能够以更高的频率工作,适合对速度要求较高的应用场景。
  • 节能设计:低功耗特点使其在运行过程中能够有效减少能量损耗,适合于便携式设备和低功耗应用。
  • 高集成度:四通道设计提高了功能密度,节省了电路板空间,增强了系统的复杂性和灵活性。
  • 易于集成:其TTL兼容性和标准封装形式使得在现有电路中集成和替换非常方便。

结论

综上所述,SN74LS08DR 是一款性能优异的四通道与门集成电路,适合多种逻辑应用和电路设计需求。其卓越的速度性能、兼容性和密集的布局设计,使其在当今快速发展的电子行业中无疑是一个战略性的选择。若需要实现高效、低功耗的数字逻辑解决方案,SN74LS08DR 将会是值得信赖的理想元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.