Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TI LM258DR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) LM258DR
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- LM258DR
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- Operational Amplifier
- Electronic Component
- 0.231g
- Electronic Component
- 1
- Features
- EMI / RF
- Electronic Component
- BM0000000513
- Operating Temperature
- 25℃~+85℃
- Amplifier
- 2
- Output Current
- 30mA
- (SR)
- 300V/ms
- Power Supply Voltage
- 3V~32V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM258DR 产品概述
概述
LM258DR 是一款高性能的双路运算放大器，广泛应用于各种电子设备中，适用于需要高增益和高输入阻抗的信号处理应用。由德州仪器（Texas Instruments）制造，LM258DR 的设计充分考虑了现代电子产品对功耗、体积及工作温度范围的严格要求，使其成为理想的解决方案。
基本参数
LM258DR 在一系列重要参数上表现出色，具体如下：
- 输出电流: 每通道可提供高达 30mA 的输出电流，适合驱动多种负载。
- 供电电流: 仅需 1mA 的供电电流，有助于降低整体功耗，适合便携式和低功耗设计。
- 增益带宽积: 高达 700kHz，这意味着在较高频率下仍能维持良好的增益性能，适合快速信号应用。
- 输入偏置电流: 低至 20nA，确保高输入阻抗，适合测量和放大微弱信号。
- 输入补偿电压: 低至 3mV，减少了输入失真，提高精度。
- 供电电压: 支持宽广的供电范围，单电源时为 3V 到 32V，双电源时为 ±1.5V 到 ±16V，灵活满足不同设计需求。
- 压摆率: 0.3V/µs，适合处理中低速信号。
- 工作温度范围: -25°C 到 85°C，符合众多工业和商业应用的环境需求。
封装与安装
LM258DR 采用了表面贴装型的 8-SOIC 封装，体积小巧，适合空间受限的应用。其设计考虑了自动化焊接及组装工艺，便于大规模生产和集成至复杂电路中。
应用领域
LM258DR 运算放大器广泛应用于各类电子产品，如：
- 传感器信号调理: 由于其高输入阻抗特性，LM258DR 非常适合用于传感器信号的放大和处理。
- 音频信号处理: 适合高保真音频系统中，用于放大音频信号，确保音质的纯净与良好。
- 滤波器设计: 其良好的增益特性和频率响应能力使其成为主动滤波器设计中的理想选择。
- 数据采集系统: 在数据采集系统中，用于对检测信号的调理和放大，以确保信号的准确性和完整性。
性能优势
LM258DR 的多项性能优势使其在市场上竞争力十足：
- 低功耗: 仅需 1mA 的供电电流，对于要求长电池寿命的便携式应用非常重要。
- 宽工作电压: 宽广的供电电压范围使设计灵活度大幅提升，适应各种供电环境。
- 可靠性和稳定性: 经过严苛的温度和电压测试，LM258DR 的稳定性和可靠性使其适用于工业环境。
总结
LM258DR 运算放大器凭借其出色的电气性能、灵活的应用领域和优越的性价比，成为众多电子工程师和设计师的首选。无论是在现代嵌入式系统、音频设备，还是在复杂的传感器布局中，LM258DR 都表现出了卓越的性能，充分满足了当今市场对高品质电子元器件的需求。对于需要高增益、低功耗和可靠性的通用放大器解决方案，LM258DR 绝对是一个值得推荐的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
