WMSIC Electronic Components

TI TMP6131QDECRQ1

ModelTMP6131QDECRQ1
Package0402
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) TMP6131QDECRQ1
Type
TI
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
TMP6131QDECRQ1
Electronic Component
1
Electronic Component
0.6mm
Package
0402
Electronic Component
PTCThermistor Resistor
Electronic Component
0.013g
Electronic Component
1mm
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0262721319
Operating Temperature
40℃~+125℃
Operating Voltage
5.5V
Resistor
±1%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMP6131QDECRQ1 产品概述

TMP6131QDECRQ1 是一款基于 0402 封装的高精度 PTC 温度敏感元件(标称阻值 10 kΩ,精度 ±1%),适用于对空间和成本有严格限制的表面贴装温度检测场合。该器件尺寸约为 1.0 mm × 0.6 mm(0402 / 1006 公制),支持在 -40°C 至 +125°C 的工作温度范围内可靠工作,最大工作电压为 5.5 V(具体使用条件应参照制造商数据手册确认)。

一、主要参数要点

  • 标称阻值:10 kΩ(通常指 25°C 时的阻值,具体基准温度以厂家资料为准)
  • 阻值精度:±1%
  • 温度系数:PTC 类型(阻值随温度上升而上升)
  • 工作温度:-40°C ~ +125°C
  • 最大工作电压:5.5 V
  • 封装尺寸:0402(1.0 mm × 0.6 mm)
  • 品牌:TI(德州仪器)

二、功能与优势

  • 小尺寸、高密度贴片:0402 封装便于在有限 PCB 面积内实现精确温度检测,适合移动设备、可穿戴与物联网终端。
  • 高精度:±1% 初始阻值公差,减少标定工作量,提高系统测量一致性。
  • 宽温区适用:-40°C 至 +125°C 满足工业级与消费类多数应用需求。
  • 低功耗:作为被动热敏元件,本体无主动供电,系统能耗主要来自读取电路,便于低功耗设计。

三、典型应用

  • 电池管理系统(BMS):电芯表面或组包温度监测与热平衡控制。
  • 工业与汽车电子(需参考汽车等级认证):电机驱动、功率模块温度监测。
  • 消费电子与可穿戴设备:芯片、射频模块或散热关键点的温度补偿。
  • 环境监测与 HVAC 控制:成本受控的温度采样节点。

四、使用建议与电路集成

  • 读取方式:常用电路为拉上/拉下电阻的分压电路,输出连接 ADC 或比较器。为获得最佳灵敏度,参考目标温度区间选择分压电阻量级(一般与 10 kΩ 同量级)。
  • 测试与标定:建议在目标工作环境进行一次全温区标定,补偿器件个体差异与安装热阻。
  • 焊接工艺:0402 尺寸对回流温度曲线敏感,推荐按照通用无铅回流工艺并控制机械应力;清洗与助焊剂选择应避免残留对阻值长期漂移的影响。
  • 布局建议:为减少 PCB 热耦合误差,传感器应靠近被测点并避免大面积铜箔下方直接加热;必要时使用热孔或隔热结构。

五、选型与可靠性注意事项

  • 确认 10 kΩ 阻值参考温度(通常为 25°C)与阻温曲线(B 值或热敏特性曲线)。
  • 在高湿、强腐蚀环境下,注意表面涂层及封装耐久性,必要时选用额外封装保护或密封措施。
  • 长期漂移与循环应力:建议参考厂家可靠性测试报告(热循环、湿热、机械振动)并结合实际寿命方案做应力裕度。
  • 订购编码中后缀可能含有温度等级、测试等级或包装形式信息(如汽车级 Q1 标识、卷盘包装等),采购时以厂家数据手册与授权分销商信息为准。

如需进一步设计支持(包括分压阻值计算示例、温度-阻值查表或与 ADC 接口的参考电路),可提供目标测温范围与系统供电/ADC 分辨率等信息,我可以协助给出具体电路与参数建议。

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