WMSIC Electronic Components

TI SN74LS14DR

ModelSN74LS14DR
PackageSOIC-14
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) SN74LS14DR
Type
TI
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LS14DR
Electronic Component
1
Package
SOIC-14
Electronic Component
Inverter
Electronic Component
74LS
Electronic Component
0.264g
Electronic Component
1
Electronic Component
1
Channel Count
6
Features
Electronic Component
Electronic Component
BM0000641313
Operating Temperature
0℃~+70℃
Operating Voltage
4.75V~5.25V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LS14DR 产品概述

1. 产品简介

SN74LS14DR 是由德州仪器 (Texas Instruments, TI) 设计和生产的一款高性能、低功耗的施密特触发器,采用14引脚 SOIC 表面贴装封装。该器件包含六个独立的反相器,适用于多种逻辑电平转换和信号整形应用。由于其引入了施密特触发器的特性,相较于普通反相器,其在输入信号的转换过程中具有更强的抗干扰能力和高噪声裕度,从而在实际电路设计中表现出色。

2. 主要特性

SN74LS14DR 的关键特点包括:

  • 施密特触发器功能:拥有内置的施密特触发机制,确保输入信号的平滑切换,降低由信号噪声引起的误触发。
  • 逻辑电平:其逻辑电平高(1.9V)和逻辑电平低(0.5V)表现出极好的电平识别能力,确保在多种操作条件下保持稳定状态。
  • 传播延迟:在5V电源与15pF负载条件下,最大传播延迟为22ns,为高速数字电路设计提供了支持。
  • 工作温度:器件可在0°C到70°C的环境下稳定工作,适用于绝大多数工业和消费类电子设备。
  • 电流输出能力:在输出高电平时,最大输出电流为400µA;而在输出低电平时,最大输出电流为8mA,能够驱动一定的负载。

3. 工作电压与电流条件

SN74LS14DR 的输入和输出工作电压范围为4.75V到5.25V,适合于标准的TTL(晶体管-晶体管逻辑)电路。其设计允许在电源电压发生轻微变化的情况下仍能保持可靠的逻辑操作,从而为客户提供灵活的系统设计选择。

4. 应用场景

凭借其出色的特性,SN74LS14DR 可广泛应用于以下各个领域:

  • 信号整形:可用于清理不规则的信号,以确保后续电路中逻辑电平的可靠性和准确性。
  • 方波产生:在需要产生周期性方波信号的应用中,使用施密特触发器可轻松产生稳定的方波输出。
  • 逻辑电平转换:用于不同逻辑电平之间的转换,解决多个子系统或组件间互联时的兼容性问题。
  • 定时和脉冲生成电路:在定时器和各种自动控制电路中,施密特触发器通常被用来精确控制时间和脉冲宽度。

5. 封装信息

SN74LS14DR 采用14-SOIC封装,方便表面贴装,适用于现代电子设计中越来越紧凑的空间要求。其散热性能良好,有助于提高器件的可靠性和运营效率。

6. 结论

作为一款高效、低功耗的施密特触发器,SN74LS14DR 在电路设计中的多功能性和可靠性使其成为许多应用场景下的优选方案。其结构紧凑、性能卓越、适用性广泛的优点,确保了其能够应对当今电子设备中的复杂需求。对于需要稳定信号整形、精确控制及逻辑电平转换的工程师而言,SN74LS14DR 是一个值得信赖的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.