Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TI LM311DR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) LM311DR
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- LM311DR
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- Comparator
- Electronic Component
- 0.173g
- Power Supply
- 5V~30V
- Electronic Component
- 1
- Features
- Voltage
- Electronic Component
- BM0093065446
- Operating Temperature
- 0℃~+70℃
- Comparator
- Electronic Component
- Output
- TTL；CMOS
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM311DR 产品概述
LM311DR是德州仪器（Texas Instruments）推出的一款高性能比较器，广泛应用于各类电子设备的信号处理与自动化控制系统。作为一种通用型比较器，LM311DR具有出色的电气特性和灵活的应用范围，尤其适用于需要高精度比较和快速响应的场合。
基础参数和电气特性
LM311DR支持的供电电压范围为3.5V至30V，或±1.75V至15V，使其在多种电源条件下均能稳定工作。其输入补偿电压最大值为7.5mV（在±15V条件下），有效地降低了比较器由于输入偏差而造成的误动作，同时其输入偏置电流最大值仅为0.25µA，这意味着在静态状态下几乎不会对输入信号造成显著影响。静态电流达到最大值7.5mA，其设计使得该器件在实施复杂信号处理时，能够有效降低功耗，保证系统整体的能效。
LM311DR具备MOS，开路集电极和开路发射极输出特性，能够满足不同应用的输出需求。其TTL输出状态兼容性使得与其他数字器件的集成更加方便，得到了广泛的应用。在电路设计中，能够为设计师提供更大的灵活性，支持广泛的逻辑操作及信号传输。
应用场景
LM311DR因其高输入阻抗和宽工作温度范围（0°C至70°C）的特性而非常适合以下应用场景：
信号检测与转换：可以用作电压比较器，尤其在需要阈值检测的电路中，通过比较输入信号与参考电压，实现自动信号检测与响应。
波形整形：通过将输入合理配置，LM311DR可以用作整形电路，转换非规则信号为方波输出，适用于时钟信号的生成及数据传输。
电流监测：作为电流监测工具，LM311DR能帮助设计师在电源电路中实现过流保护，提高电路的可靠性。
温度监控：在温度传感器应用中，LM311DR可以通过对温度传感器信号的比较与处理，实现温度的报警及控制，尤其适合用于家庭和工业温控系统。
封装与安装
LM311DR采用8-SOIC（表面贴装型）封装，尺寸为0.154"（3.90mm宽），适合各种紧凑型电子设备中进行安装。表面贴装式设计使得LM311DR能够在高速自动化生产中轻松被焊接，降低装配成本，提高生产效率。其小巧的体积让它在空间有限的设备中表现出优越的适应性。
总结
总体来看，LM311DR是功能强大且灵活的比较器，凭借其优异的电气性能、宽广的适用电源范围和多样的输出方式，成为各类电子产品中的核心组件。德州仪器的信誉和持续的技术支持，更是使得该产品在市场中的竞争力不断增强。无论是用于工业应用还是消费电子产品，LM311DR都能为工程师提供高效、可靠的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
