WMSIC Electronic Components

TI TPS63700DRCR

ModelTPS63700DRCR
PackageVSON-10-EP(3x3)
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) TPS63700DRCR
Type
TI
Unit
Electronic Component
Minimum package
3000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
TPS63700DRCR
Electronic Component
1
Package
VSON-10-EP(3x3)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.039g
Electronic Component
1
Features
Load
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227582838
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
2.7V~5.5V
Switching Frequency
1.38MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPS63700DRCR 产品概述

一、产品简介

TPS63700DRCR 是德州仪器(TI)推出的一款升降压型反相 DC-DC 转换器,面向需从单节或多节锂电池(2.7V~5.5V)产生可调负电压的便携式和工业应用。器件集成开关管,工作频率高达约1.38MHz,输出可调范围为 -15V 至 -2V,最大输出电流可达 360mA,静态电流仅约 400µA(IQ),适合对尺寸、效率和静态功耗有较高要求的负电源设计。

二、主要特性

  • 输入电压范围:2.7V ~ 5.5V,兼容单节锂电池及常见系统电压轨。
  • 输出电压:可调负电压,范围 -15V ~ -2V,便于满足不同模拟/混合集成电路的偏置要求。
  • 输出电流:最大 360mA,适合驱动小功率放大器、参考源和模拟前端。
  • 开关频率:约 1.38MHz,有利于使用小型电感/电容,节省 PCB 面积。
  • 同步整流:否(非同步拓扑),器件通过集成开关实现反相转换。
  • 静态电流(IQ):约 400µA,有利于中等待机功耗优化。
  • 封装:VSON-10-EP (3×3 mm),带热焊盘,利于散热与高密度布局。
  • 拓扑:反相式(升降压型),在输入高于或低于目标负电压时均能稳定工作。

三、典型应用场景

  • 便携式设备的负电源生成(如便携音频放大器、传感器前端)。
  • 模拟电路偏置(运放、A/D 采样电路需要负轨时)。
  • 通信与仪表设备中需要小功率负电压的子系统。
  • 电池供电便携终端,需紧凑电源解决方案且兼顾能效和热量控制。

四、设计要点与布局建议

  • 电容选择:输入、输出和补偿电容应选用低 ESR 陶瓷电容,且容量根据输出电流及纹波需求调整;高频工作下靠近器件焊盘布局尤为重要。
  • PCB 布局:将输入电容和输出电容尽量靠近器件的 VIN/GND 与 VOUT/GND 引脚;充分利用 VSON 封装的底部热焊盘(EP)进行散热并通过多层接地平面扩展热路径。
  • 电阻分压设置输出:输出为可调型,通过外部反馈分压网络设定负电压,布线需短且避免噪声耦合。
  • 热管理:在高负载下注意器件功耗与温升,必要时扩大散热铜箔和增加过温保护方案。
  • EMI 抑制:高频开关可能产生辐射,建议在输入端并联合适的滤波元件并优化走线,必要时做屏蔽与滤波优化。

五、封装与可靠性

  • 封装为 VSON-10-EP (3×3 mm),适合高密度应用且便于热量导出。工作环境温度范围为 -40℃ 到 +85℃(TA),适用于工业级和消费级环境。
  • 器件内部集成开关管和必要保护电路,具体保护特性(如过流、过温、启动行为等)请以官方数据手册为准。

六、选型建议与注意事项

  • 若应用需较高效率和较大输出电流,评估系统热预算与散热措施;若对效率要求更高且可接受复杂度,可考虑带同步整流的替代器件。
  • 设计时务必参考 TI 官方数据手册与评估板原理图,按建议的外部元件和布局指南进行,以确保稳定性与 EMI 性能。
  • 对于极低待机功耗场景,应验证 IQ 在实际工作模式下的贡献并评估唤醒/关断策略。

总体而言,TPS63700DRCR 提供了一种紧凑、高频、可调负电压解决方案,适用于需要负轨但空间受限的便携与工业应用,其集成度和工作频率有利于减小外围元件尺寸并简化系统设计。

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