WMSIC Electronic Components

TI CSD17483F4

ModelCSD17483F4
PackagePicoStar-3
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) CSD17483F4
Type
TI
Unit
Electronic Component
Minimum package
3000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
CSD17483F4
Electronic Component
1
Package
PicoStar-3
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.026g
Electronic Component
1
Electronic Component
BM0228088597
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
500mW
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
190pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CSD17483F4 产品概述

CSD17483F4 是德州仪器(Texas Instruments,TI)推出的一款高性能 N 通道 MOSFET,广泛应用于各种电子电路中,特别是在开关电源、负载驱动、电机控制以及高效率转换器等领域。这一型号在设计时考虑了低功耗和高效率,适合追求小巧尺寸和高性能的市场需求。

基本特征与规格

CSD17483F4 MOSFET 的额定漏源电压(Vdss)为 30V,能够有效地处理一般工业和消费类应用中的电压需求。其连续漏极电流(Id)在 25°C 环境下可达到 1.5A,确保该器件在常见的负载条件下表现出色。

在驱动方面,该MOSFET支持多种 Vgs(栅源电压)下的操作,实现灵活的驱动配置。对于最小的 Rds On(导通电阻),在不同 Vgs 下,其值分别在 1.8V 和 4.5V 时具有竞争力的表现,展现了杰出的电流传输能力。在电流为 0.5A、Vgs 为 8V 时,其导通电阻最大值为 240 毫欧,显示出低导通损耗的优越特性,这使得其非常适合于高效能应用。

开关性能

CSD17483F4 的栅极阈值电压(Vgs(th))最大值为 1.1V(在 250µA 时测得),意味着其在较低的驱动电压下便能迅速导通,在提升系统效率上具有良好的表现。同时,其最大栅极电荷(Qg)为 1.3nC(在 4.5V 时测得),暗示着该 MOSFET 在高频开关应用中的脑力表现,可以有效减少开关损耗,特别适合于需要频繁开关转换的应用场合。

热性能与功率处理

CSD17483F4 的最大功率耗散能力为 500mW(在室温下),其宽广的工作温度范围(-55°C ~ 150°C)确保了该元件在严苛的环境中仍能稳定工作。这种特性使得该 MOSFET 在汽车、工业控制和高温环境下的应用中非常受欢迎。

物理特性

该器件采用了表面贴装型(SMD)封装,具体为 6-WSON(2x2 mm),其紧凑的尺寸使得焊接和布线路径设计更加灵活便利,非常适合高密度 PCB 的设计需求。CSD17483F4 的封装特点不仅有助于降低寄生电容(如输入电容 Ciss 最大值为 190pF @ 15V),还减少了 PCB 设计中的空间占用,助力整体系统的小型化。

应用领域

得益于其卓越的电气和热性能,CSD17483F4 MOSFET 在多个应用领域中表现出色,其中包括但不限于:

  1. 开关电源:CSD17483F4 适用于 DC-DC 转换器中,可以显著提高转换效率。
  2. 电机驱动:其高电流处理能力使其成为电机控制应用的优选器件。
  3. 负载开关:在消费类电子和工业控制中,能够高效地实现负载的接通与断开。
  4. 智能设备:由于其低导通损耗和高效率,该器件在智能系统中表现尤为突出。

结论

CSD17483F4 是一个设计合理、性能卓越的 MOSFET 组件,为开发者提供了灵活性和可靠性。它不仅具备出色的电气特性和热性能,还因其紧凑的封装方式适合多种小型化应用。无论是新时代的电源管理、自动控制系统还是高效能电机驱动设计,CSD17483F4 都是一个值得信赖的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.