WMSIC Electronic Components

TI SN74LVC1G32DCKR

ModelSN74LVC1G32DCKR
PackageSC-70-5
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) SN74LVC1G32DCKR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LVC1G32DCKR
Electronic Component
1
Package
SC-70-5
Electronic Component
Logic Gate
Electronic Component
74LVC
Electronic Component
0.048g
Electronic Component
1
Channel Count
1
Features
Driver
Electronic Component
BM0140239665
Operating Temperature
40℃~+125℃
Operating Voltage
1.65V~5.5V
Logic Type
Gate

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:SN74LVC1G32DCKR

SN74LVC1G32DCKR是一款由德州仪器(TI)生产的高性能单通道或门IC。其设计使其能够有效地在多种数字电路应用中进行信号逻辑运算。该器件的引入提供了一种高效、可靠且灵活的方式来实现逻辑功能,从而满足现代电子设备对小型化、低功耗以及高速度的需求。

基本参数与特性

  1. 安装类型与封装:SN74LVC1G32DCKR以表面贴装型(SMD)形式提供,封装为SC-70-5。这种小型封装使其非常适合于空间受限的应用,例如手机、平板电脑及便携式设备等。

  2. 供电电压范围:该器件能够在1.65V到5.5V的宽电压范围内工作,这使其与各种逻辑电平兼容,适配不同的系统设计需求。

  3. 逻辑电平:SN74LVC1G32DCKR的逻辑电平高要求在1.7V至2V范围内,而低电平则在0.7V至0.8V之间。这种特性使该芯片能够处理高速数字信号,从而确保在现代高速通信和处理应用中的良好性能。

  4. 传播延迟:在5V电源、50pF负载条件下,最大传播延迟仅为4ns。这样的低延迟特性使得该逻辑门可以在高频率应用中保持高效的信号处理能力,适合诸如高速数据总线和时钟脉冲处理等特性。

  5. 静态电流:该器件具有极低的静态电流,最大值仅为10µA,这大大降低了功耗,适合于电池供电的设备,延长了设备的使用寿命。

  6. 逻辑输出能力:SN74LVC1G32DCKR的输出电流能力为32mA,这使其能够驱动较大负载,而且在高负载情况下依然维持良好的逻辑信号完整性。

  7. 工作温度范围:器件的工作温度范围从-40°C到125°C,使其适用于各种工业应用,包括汽车和消费电子产品。

  8. 输入数量:该IC具有一个或门,包含2个输入端,为设计者提供了灵活的逻辑运算能力。用户可以根据需要实现多种逻辑功能。

应用场合

SN74LVC1G32DCKR适用于广泛的应用场合,包括但不限于:

  • 消费电子:如计算机、智能手机和数码相机等,能够在需要高速开关和逻辑操作的地方发挥作用。
  • 工业控制:其宽广的工作温度范围和稳定性使其适合于工业自动化和控制系统。
  • 汽车电子:在汽车中,该器件可用于各种逻辑控制,以及信号管理和传输。
  • 通信设备:可用于实现通信接口中的数据逻辑处理,确保数据的高效传输。

总结

总体来看,SN74LVC1G32DCKR是一个功能强大而灵活的单通道或门IC,具备低功耗、高速度和宽电压范围等优越特性。其表面贴装封装和小巧设计非常适合当今对高集成度电子产品的需求。凭借德州仪器的强大技术支持和可靠的产品质量,SN74LVC1G32DCKR为各种数字电路应用提供了理想的解决方案,是广大电子工程师和设计者的极佳选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.