WMSIC Electronic Components

TI LMC6032IMX/NOPB LMC6032IMX

ModelLMC6032IMX/NOPB
Package8-SOIC
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) LMC6032IMX / NOPB
Type
TI
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
LMC6032IMX/NOPB
Electronic Component
1
Package
8-SOIC
Electronic Component
Precision Op Amp
Electronic Component
0.173g
Electronic Component
1
Electronic Component
BM0058419930
Operating Temperature
40℃~+85℃
Amplifier
Electronic Component
Output Current
40mA
(SR)
1.1V/us
Power Supply Voltage
4.75V~15.5V
Static Current(Iq)
750uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMC6032IMX/NOPB 精密运算放大器产品概述

一、核心身份与封装规格

LMC6032IMX/NOPB是德州仪器(TI)推出的双路精密运算放大器,采用8引脚小外形集成电路(SOIC-8)封装,体积紧凑(引脚间距1.27mm),适配高密度PCB布局需求。该器件定位为低功耗、高输入阻抗型运放,是工业控制、便携式设备等领域的经典选型。

二、关键性能参数解析

该运放的核心参数精准匹配低功耗精密放大场景,具体特性如下:

  1. 低功耗设计:静态电流仅750μA(典型值),支持4.75V~15.5V单电源供电,双电源时最大电源差(Vdd-Vss)可达15.5V,无需额外电源管理即可适配电池或直流电源系统。
  2. 高输入阻抗:输入偏置电流(Ib)仅0.04pA,输入失调电流(Ios)0.01pA,可直接驱动高阻抗信号源(如光电二极管、电容式传感器),无需缓冲级匹配阻抗。
  3. 精密直流性能:输入失调电压(Vos)1mV(典型值),失调电压温漂(Vos TC)2.3μV/℃,共模抑制比(CMRR)83dB,有效抑制共模干扰,保证直流信号放大精度。
  4. 带宽与输出能力:增益带宽积(GBP)1.4MHz,压摆率(SR)1.1V/μs,输出电流最大40mA,可满足中等带宽信号(如音频、低速数据采集)的放大与负载驱动。
  5. 低噪声特性:1kHz时噪声密度仅22nV/√Hz,适合微伏级微弱信号(如传感器输出)的检测与放大。
  6. 宽温度适应性:工作温度范围-40℃~+85℃,符合工业级温度标准,可在恶劣环境下稳定工作。

三、典型应用场景

结合参数特性,该运放的核心应用场景包括:

  1. 便携式设备信号调理:低功耗(750μA)+单电源兼容(4.75V~15.5V),适配手持仪表、无线传感器节点等电池供电设备。
  2. 高阻抗传感器前端:光电二极管、应变片、电容式压力传感器等输出阻抗高的信号源,可直接通过该运放放大,无需额外缓冲电路。
  3. 精密数据采集系统:低失调、低温漂特性,适合工业温度、压力等模拟量的高精度采集。
  4. 中等带宽放大电路:如音频前置放大器、低速通信信号放大(1.4MHz带宽覆盖常见音频与低速数字信号)。
  5. 汽车电子与工业控制:-40℃~+85℃宽温范围,可用于车载传感器调理、工业自动化设备的信号放大环节。

四、应用注意事项

  1. 电源连接:单电源应用时,输入信号需保持在共模输入范围内(通常接近电源轨);双电源应用时,Vdd与Vss压差不得超过15.5V,避免过压损坏。
  2. 输出负载限制:最大输出电流40mA,需避免输出端直接短路或驱动过重负载(如小于100Ω的电阻负载)。
  3. 输入保护:虽内置ESD保护,但高阻抗输入引脚需避免静电放电(ESD),建议PCB设计中增加输入限流电阻(如1kΩ)。
  4. 失调微调:若需更高精度,可通过外部电位器对输入失调电压进行微调(参考TI官方 datasheet 推荐电路)。

五、同类产品对比优势

与传统通用运放(如LM358)相比,LMC6032IMX/NOPB的核心优势:

  • 偏置电流低10^6倍:0.04pA vs LM358的nA级,更适合高阻抗信号源;
  • 噪声更低:22nV/√Hz@1kHz vs LM358的~50nV/√Hz,微弱信号检测更清晰;
  • 温漂更小:2.3μV/℃ vs LM358的~10μV/℃,温度变化下精度更稳定;
  • 宽温范围:工业级-40℃+85℃ vs LM358的商业级0℃70℃,环境适应性更强。

综上,LMC6032IMX/NOPB是一款兼顾低功耗、高输入阻抗与精密性能的双路运放,适合对精度、噪声及环境适应性有要求的各类电子系统设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.