WMSIC Electronic Components

TI SN74LVC1G332DCKR

ModelSN74LVC1G332DCKR
PackageSC-70-6
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) SN74LVC1G332DCKR
Type
TI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LVC1G332DCKR
Electronic Component
1
Package
SC-70-6
Electronic Component
Logic Gate
Electronic Component
74LVC
Electronic Component
0.042g
Electronic Component
1
Channel Count
1
Features
Driver
Electronic Component
BM0058420530
Operating Temperature
40℃~+125℃
Operating Voltage
1.65V~5.5V
Logic Type
Gate
Current(IOH)
32mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LVC1G332DCKR 产品概述

一、产品简介

SN74LVC1G332DCKR 是德州仪器(TI)系列 74LVC 中的一款单通道三输入或(OR)门,采用 SC-70-6(DCK)超小型封装。器件工作电压范围宽(1.65V 至 5.5V),静态电流低(Iq ≈ 10 μA),为空间受限且对功耗敏感的系统提供了高驱动能力与高速逻辑功能。

二、主要规格要点

  • 逻辑类型:单通道三输入或门(1‑channel, 3 inputs)
  • 工作电压:1.65V ~ 5.5V(低压与标准逻辑系统兼容)
  • 输入阈值:VIH = 1.7V ~ 2.0V,VIL = 0.7V ~ 0.8V(对低电平供应和 TTL/低压逻辑有良好兼容性)
  • 输出能力:IOH / IOL = ±32 mA(强驱动能力,适合驱动多个下游输入或小负载)
  • 传播延迟:tpd = 4.5 ns @ 5.0V, CL = 50 pF(高速响应,适合时序要求严格的场合)
  • 输出电平示例:VOH 典型值示例为 2.4V / 3.8V(随供电电压与负载变化)
  • 输出低电平:VOL ≈ 550 mV
  • 静态电流:Iq ≈ 10 μA(低功耗静态特性)
  • 工作温度:-40 ℃ ~ +125 ℃(适合宽温环境应用)
  • 封装:SC-70-6(小尺寸,便于高密度布局)

三、封装与引脚(概述)

SC-70-6(6引脚)封装利于节省 PCB 面积,常见引脚分配为:三个输入端(A、B、C),一个输出端(Y),以及 VCC、GND。建议在 VCC 与 GND 近旁放置去耦电容以保证开关瞬态性能。

四、设计注意事项

  • 供电与地线:在靠近器件处放置 0.1 μF 去耦电容,减小瞬态电压跌落和噪声对阈值的影响。
  • 负载能力:器件可提供较大的源/汇流能力(±32 mA),但高电流会使 VOH/VOL 发生偏移,设计时应考虑导通压降和功耗。
  • 输入处理:避免悬空输入,未使用输入应拉到确定电平以避免增加功耗或产生错误输出。
  • 温度与可靠性:器件支持 -40 ℃ 至 +125 ℃ 工作温度,适合严苛环境,但若需车规级认证请参照 TI 数据手册与型号认证信息。

五、典型应用

  • 逻辑拼接与胶水逻辑(glue logic)
  • 多信号合并(中断或使能合并)
  • 低压电平系统与接口逻辑(1.8V、2.5V、3.3V 系统互联)
  • 手持设备、便携式电子、工业控制等对体积与功耗敏感的产品

总结:SN74LVC1G332DCKR 以其宽电源范围、低静态功耗、高驱动能力和小尺寸封装,适合在多种低压与混合电压系统中作为高效的三输入或门解决方案。选型时请结合实际供电、负载和温度条件,参阅 TI 官方数据手册以获取完整电气特性与时序图。

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