WMSIC Electronic Components

TI LM5146RGYR

ModelLM5146RGYR
PackageVQFN-20(3.5x4.5)
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) LM5146RGYR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
LM5146RGYR
Electronic Component
1
Package
VQFN-20(3.5x4.5)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.076g
Electronic Component
1
Features
Built-in LDORegulator; Frequency Synchronous;;;; EMI Optimization
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227583141
Operating Temperature
40℃~+150℃@(TJ)
Operating Voltage
5.5V~100V
Switching Frequency
1MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM5146RGYR 产品概述

一 产品简介

LM5146RGYR 是德州仪器(TI)面向宽输入电压应用的降压型 DC-DC 电源控制器(Buck),工作输入电压范围为 5.5V 至 100V,适合高压至中低压转换场景。器件为同步整流控制、单输出通道的降压拓扑,采用外置功率开关管设计,内置高性能控制电路,典型开关频率为 1MHz,结温工作范围为 -40℃ 至 +150℃(@TJ),封装为 VQFN-20 (3.5 x 4.5 mm)。

二 主要特性(基于给定参数)

  • 宽输入电压:5.5V ~ 100V,适用于汽车、工业及轨道等高压系统。
  • 降压拓扑:高效将高电压降至目标输出电压。
  • 开关频率:1MHz 级别,利于减小电感和输出电容体积,实现高功率密度设计。
  • 同步整流:支持提高转换效率并降低导通损耗(需外置同步 MOSFET)。
  • 单路输出:适配单通道电源需求,外置开关管给予设计灵活性。
  • 宽温工作:-40℃ ~ +150℃(结温),适合严苛环境和汽车电子级可靠性要求。
  • 封装:VQFN-20 (3.5x4.5) 小型化封装,便于高密度 PCB 布局。

三 典型应用场景

  • 汽车 12V/24V 到车载电子供电或点火模块电源(符合高压瞬态要求)。
  • 工业供电系统与分布式电源模块。
  • 电源管理模块、通信设备电源及需要高效率和小体积的便携或嵌入式设备。

四 设计要点与建议

  • 外置 MOSFET 选择:因为为外置开关管设计,应优先选择低 RDS(on)、低栅荷(QG)且适配 100V 余量的功率 MOSFET,以兼顾效率与开关损耗。
  • 开关频率与元件选型:1MHz 频率可缩小电感与电容,但需注意器件的峰值电流能力与磁性器件的损耗管理。
  • 输出滤波:采用低等效串联电阻(ESR)电容配合合理电感值以抑制输出纹波并满足瞬态响应。
  • 布局与 EMI:开关回路(MOSFET、二极管/同步桥、输出电感和输入电容)应尽量紧凑以降低回路面积;必要时加屏蔽或滤波器以满足辐射测试。
  • 热管理:尽管器件支持高结温,仍需合理的 PCB 散热方案(敷铜、过孔热通道)以及器件周围的热敏元件布局。

五 封装与可靠性

VQFN-20 (3.5 x 4.5 mm) 提供紧凑占板面积,适合空间受限设计。器件的高温额定(-40℃ 至 +150℃@TJ)表明适合汽车级和工业级应用,但在实际应用中应按照 TI 的参考设计和热阻数据进行板级与系统级热仿真与验证。

六 结论

LM5146RGYR 以其 5.5V~100V 的宽输入、1MHz 开关频率与同步整流特点,为需要高压降压、体积受限且对效率与可靠性有较高要求的系统提供了灵活的控制平台。实际设计时注意外置功率器件的选择、开关回路布局与热管理,可在保证可靠性的同时获得高效率与小尺寸的电源方案。

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