Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TS5A23157DGSR 是德州仪器(Texas Instruments)推出的一款高性能模拟开关,其设计旨在提供高频处理和极低的导通电阻,以满足各种低功率和高速度信号切换的应用需求。此款模拟开关采用表面贴装型封装(10-VSSOP),便于与现代电子电路设计兼容,适合广泛的电子设备中使用,例如便携式设备、通讯设备和测试仪器等。
TS5A23157DGSR 的基础参数包括一个单刀双掷(SPDT)开关电路和2:1的多路复用器/解复用器配置,能够实现2个电路的有效切换。同时,该元器件的导通电阻最大值为10欧姆,确保在切换过程中信号衰减最小。此外,该器件的通道至通道匹配(ΔRon)为150毫欧,保证了各个通道之间的良好一致性。
电压范围: TS5A23157DGSR 的单电源电压输入范围为1.65V至5.5V,能够适应从低电压到高电压的多种应用场景。
开关速度: 该产品的开关时间(Ton 和 Toff)分别为最大5.7纳秒和最大3.8纳秒,提供快速的信号切换能力,适应高速信号处理的要求。
带宽: 该模拟开关拥有-3dB带宽高达220MHz,适合高带宽应用,能够有效处理高速数据流。
泄漏电流: 最大漏电流(IS(off))为1µA,确保设备在待机状态下的低功耗运行,适合便携设备和长电池寿命的应用。
串扰: TS5A23157DGSR 在10MHz时的串扰低至-66dB,极大地减少了信号间的干扰,提高了信号的完整性和稳定性。
电荷注入: 电荷注入为7pC,这一低值有助于减少对敏感信号的影响,尤其是在模拟信号处理的场景中至关重要。
沟道电容: 沟道电容(CS(off), CD(off))为5.5pF,这一参数说明该开关在非导通状态下依然能保持较低的邻近通道干扰。
TS5A23157DGSR 适用于多种需要信号切换的应用场合,包括:
便携式设备: 由于其小型封装和低功耗特性,适合用于手机、平板等便携式电子设备中,支持音频、视频及数据流的切换。
音频/视频设备: 由于其高带宽和低串扰性能,非常适合于音频信号和视频信号的切换,能够在多媒体应用中提供卓越的音质和视频质量。
通讯设备: 在无线和有线通讯设备中,该开关可以高效地执行信号的路由和选择功能,提升系统的灵活性和响应速度。
测试设备: 在信号测试系统中,TS5A23157DGSR 可以用作信号源的切换,帮助工程师进行精确的信号监测和分析。
TS5A23157DGSR 作为德州仪器的最新模拟开关产品,以其优异的电气特性、紧凑的封装和广泛的应用潜力,成为工程师在设计高性能电子系统时的理想选择。无论是在低功耗设备、高频信号处理还是在复杂的通讯环境中,TS5A23157DGSR 无疑都是一个值得信赖的解决方案。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products