WMSIC Electronic Components

TI TL431BCDBZR

ModelTL431BCDBZR
PackageSOT-23-3
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) TL431BCDBZR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
TL431BCDBZR
Electronic Component
1
Package
SOT-23-3
Electronic Component
Voltage Reference IC
Electronic Component
±0.5%
Electronic Component
0.05g
Electronic Component
1
Electronic Component
BM0227583021
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~36V
Output Voltage
2.5V~36V
Output Current
100mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TL431BCDBZR 产品概述

一、产品简介

TL431BCDBZR 是德州仪器(TI)供应的一款高精度可调并联式(分流型)电压基准/稳压芯片,封装为 SOT-23-3。器件提供精确的参考电压,可作为可调恒压基准或分流稳压元件使用,适合电源参考、精密电压监测和简单的低成本稳压方案。

二、主要技术参数

  • 输出类型:可调(并联/分流型)
  • 参考电压(典型):约 2.495 V(可通过外部电阻调整输出)
  • 输出电流(最大):100 mA(分流能力)
  • 精度:±0.5%(初始参考精度)
  • 最小工作/阴极调节电流:1 mA(保持在此电流以上以保证基准精度)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 工作/输出电压范围:约 2.5 V ~ 36 V
  • 封装:SOT-23-3

三、主要特点与优势

  • 高精度:±0.5% 初始精度,适合对参考源稳定性有较高要求的应用。
  • 宽电压范围:工作电压覆盖 2.5 V 至 36 V,适用于多种供电环境。
  • 较大分流能力:最高 100 mA 输出(分流),可在较宽的电流范围内作为分流稳压元件。
  • 小封装:SOT-23-3 适合空间受限的便携或板级设计。
  • 宽温度工作范围:适合工业级温度要求的基本应用场景。

四、典型应用场景

  • 开关电源反馈参考与断电检测
  • 精密基准源与比较电路
  • 可调式分流稳压(小功率线性稳压替代)
  • 电池管理、欠压/过压检测与电压监控
  • 仪表前端与ADC参考电源(在合适的滤波与隔离设计下)

五、设计与使用要点

  • 设定输出电压:采用外部分压网络(R1、R2),基本公式为:VOUT ≈ VREF × (1 + R1/R2)(IREF 引脚电流影响较小,应在精密设计时考虑)。
  • 最小阴极电流:为保证器件在额定精度内工作,阴极电流应始终高于 1 mA。设计分压电阻时要确保在最大负载条件下仍有足够的分流电流。
  • 功耗与热管理:作为分流器件,器件承受的功耗为 Pd = (VIN - VOUT) × IK(IK 为流经芯片的分流电流)。在高压差或大分流电流时,SOT-23-3 封装的热耗限制会成为约束,超过安全功耗需降低电流或改用散热更好的方案。举例:若 VIN−VOUT = 10 V 且 IK = 50 mA,则 Pd = 0.5 W,对 SOT-23-3 是较大的热应力,应评估工作温升。
  • 稳定性与旁路:在参考端(REF)或阴极至地回路适当位置并联小电容(几纳法到几十纳法)可改善噪声与瞬态响应,但不同负载和外部电路可能对稳定性有影响,建议在样片验证后确定电容及 ESR 要求。
  • 布局建议:保持 REF 引脚附近的走线短且低阻抗,阴极与地的回流路径应尽量直接,避免大阻抗串联影响参考精度。

六、封装与选型提示

  • SOT-23-3 适于体积受限设计,但热耗、最大分流电流及长期散热需在系统层面评估。
  • 如系统要求更高功率耗散或更严格温漂性能,可考虑更大封装或专用线性稳压器/参考源。
  • 选型时确认所购型号的精度等级、温度系数与长期漂移指标,评估能否满足目标系统在整个温度与时间尺度下的稳定性要求。

总结:TL431BCDBZR 在小体积下提供高精度、可调的分流基准功能,适合多种参考与分流稳压应用。合理设计分压、保证最低工作电流并注意功耗与热管理,能充分发挥该器件的性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.