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TI SN74LVC1G04DCKR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) SN74LVC1G04DCKR
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- SN74LVC1G04DCKR
- Electronic Component
- 1
- Package
- SC-70-5
- Electronic Component
- Inverter
- Electronic Component
- 74LVC
- Electronic Component
- 0.048g
- Electronic Component
- 1
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Power Supply
- Electronic Component
- BM69417921
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 1.65V~5.5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SN74LVC1G04DCKR 产品概述
一、产品简介
SN74LVC1G04DCKR 是由德州仪器（Texas Instruments）生产的一款高性能反相器。作为一款单逻辑门器件，SN74LVC1G04DCKR 具备高效的电源管理和低静态功耗设计，适用于多种数字电路应用。这款反相器采用 SC-70-5 封装，专为需要紧凑空间或高密度布线的电路板而设计。
二、主要特性
逻辑类型: SN74LVC1G04DCKR 是一种反相器，能够将输入的逻辑电平反转，构建更复杂的逻辑电路。
电源电压范围: 此器件支持宽广的供电电压范围，从 1.65V 到 5.5V，使其能够在不同的电源条件下稳定运行，适应多种应用场景。
低静态电流: 在最大静态条件下，器件的电流消耗仅为 10µA，大大降低了功耗，适合需要长时间待机的低功耗设备。
输出电流: SN74LVC1G04DCKR 的输出配置能够提供高达 32mA 的电流，确保其能够驱动较大的负载，适合在需要较高驱动能力的电路中使用。
逻辑电平阈值: 器件的逻辑电平高和低阈值分别在 1.7V 到 2V 及 0.7V 到 0.8V之间，适配不同逻辑规范的交流和兼容设计。
传播延迟: 在 5V 电源下，与 50pF 负载条件下的最大传播延迟为 3.7ns，满足高频信号传递和处理的需求，提升系统性能。
工作温度范围: 其工作温度范围为 -40°C 到 125°C，适应严酷环境下的可靠性，适合工业、汽车和消费电子等应用。
封装类型: 采用 SC-70-5 和 SOT-353 的小尺寸表面贴装封装设计，可以有效节省电路板空间，便于自动化生产和高密度布线。
三、应用领域
SN74LVC1G04DCKR 广泛应用于各种电子产品中，特别是在需要稳健数位信号处理的场景，包括但不限于：
电池供电设备: 由于其低功耗特性，该器件广泛用于便携式设备和电池供电的应用中，如智能手机、平板电脑和可穿戴设备。
自动化设备: 在工业自动化和控制系统中，反相器用于信号调理，确保系统对输入信号的准确响应。
汽车电子: 适合汽车电子中对温度和可靠性要求极高的应用，如车载显示器、传感器和控制单元。
消费电子: 由于其小型化设计，广泛应用于音响设备、家用电器等消费产品中，提升用户体验。
四、总结
SN74LVC1G04DCKR 是一款符合现代电子产品需求的高性能反相器，其优越的电气性能和灵活的应用场合，使其成为开发高效能产品的重要选择。德州仪器提供的这款反相器通过其独特的设计以及优秀的参数，确保了电子产品在低功耗、高可靠性和小型化方面的理想兼容，助力工程师设计出更具竞争力的产品。
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