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TI OPA1652AIDR
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) OPA1652AIDR
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- OPA1652AIDR
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- Audio Power Amplifier
- Electronic Component
- 0.173g
- Electronic Component
- 1
- Electronic Component
- BM69418009
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.25V~18V；-18V~-2.25V
- Static Current(Iq)
- 2mA
- Speaker Channel Count
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
OPA1652AIDR 产品概述
一、产品介绍
OPA1652AIDR是一款高性能的音频功率放大器，旨在满足广泛的音频应用需求。该产品由德州仪器（Texas Instruments）设计和制造，特别适用于音频设备的驱动和处理，如高保真音频播放器、功率放大器和音频前级放大器。OPA1652AIDR采用8-SOIC封装，具备紧凑的尺寸，适合于空间有限的电子设计中。
二、主要特性
音频放大器类型：OPA1652AIDR为双声道音频放大器，支持满摆幅输出，能够以高保真的方式处理音频信号。其卓越的音频性能使其适用于家庭音响系统、专业音频设备以及其他高质量音频产品。
电气参数：
- 压摆率：该芯片具有10V/µs的压摆率，保证了音频信号能以较高的速度和精度响应，提供平滑且失真度低的音频输出。
- 增益带宽积：OPA1652AIDR的增益带宽积高达18MHz，使其在宽频带内都能保持优秀的增益表现，适合多种音频频率范围的应用。
- 输入偏置电流：其输入偏置电流仅为10pA，减少了对输入信号影响的可能性，尤其在高阻抗信号源中表现尤为出色。
供电要求：
- 该放大器支持单电源或双电源供电，电压范围为±2.25V至±18V或4.5V至36V，灵活性强，能够适应不同的设计需求。
工作温度范围：OPA1652AIDR的工作温度范围广泛，从-40°C到+85°C，适合在多种环境条件下可靠工作。其耐久性和稳定性使其成为工业和汽车等应用的理想选择。
表面贴装型：采用8-SOIC封装，尺寸仅为0.154”(3.90mm)宽，适合现代表面贴装技术，有助于降低电路板空间和生产成本。
三、应用场景
OPA1652AIDR广泛应用于各种音频相关领域，具体包括但不限于：
- 消费类电子：如音频播放器、音乐流媒体设备和家庭影院等。
- 专业音频设备：如音响系统、调音台、吉他放大器等，需求高保真音频输出和精确的信号处理。
- 汽车音响：高温和恶劣环境耐受能力使其适合汽车音响系统的音频放大和信号处理。
- 仪器仪表：在需要高精度音频信号的测量设备中也可得到有效应用。
四、总结
OPA1652AIDR是一款优秀的音频功率放大器，其出色的电气性能、灵活的供电选择以及良好的温度稳定性，使其在高保真音频应用中展现出独特的优势。无论是在消费电子、专业音频设备还是汽车音响系统中，OPA1652AIDR都能提供卓越的音质和可靠性。同时，紧凑的8-SOIC封装设计也方便了电路的集成和尺寸优化，是现代音频设备设计的理想选择。
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