WMSIC Electronic Components

TI TLV6001IDCKR

ModelTLV6001IDCKR
PackageSC-70-5
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) TLV6001IDCKR
Type
TI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
TLV6001IDCKR
Electronic Component
1
Package
SC-70-5
Electronic Component
Operational Amplifier
Electronic Component
0.16g
Electronic Component
1
Electronic Component
Output
Features
EMI / RF; ESD
Electronic Component
BM0106473185
Operating Temperature
40℃~+125℃
Amplifier
1
Output Current
15mA
(SR)
500V/ms
Power Supply Voltage
1.8V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:TLV6001IDCKR

TLV6001IDCKR是德州仪器(Texas Instruments)推出的一款高性能运算放大器,专为低功耗和小型化电路设计而优化。这款单路运算放大器不仅在工业和消费电子领域表现优秀,而且因其适应广泛的温度范围和多种供电电压而受到工程师们的青睐。

关键特性与参数

  1. 放大器类型:TLV6001IDCKR是通用运算放大器,适用于多种应用场景,包括信号处理、滤波、数据采集和传感器接口等。

  2. 电路输出:该器件具有满摆幅输出能力,使其能够处理较大的输入信号,输出更一致的信号波形,适用于需要高精度和高线性的应用。

  3. 压摆率与增益带宽积:TLV6001的压摆率为0.5V/µs,增益带宽积为1MHz,这使它在中频信号的放大方面表现出色,能够满足大多数低频到中频信号的需求。

  4. 低功耗设计:器件的供电电流为75µA,工作电压范围宽广,从1.8V到5.5V可兼容单电源供电,且支持双电源模式(±0.9V ~ 2.75V)。这一特性使TLV6001非常适合于便携式电池供电的仪器和设备。

  5. 极低的输入偏置电流:输入偏置电流仅为1pA,这在许多高阻抗传感器接口中是一个极为重要的特性,降低了输入信号的失真,是高性能测量和数据采集应用的理想选择。

  6. 温度范围:TLV6001支持-40°C到125°C的宽工作温度范围,适合要求苛刻的工业环境以及汽车电子应用。

  7. 封装信息:产品采用SC-70-5封装,尺寸小、利于表面贴装,适合现代紧凑型电路设计,特别是在空间受限或高密度集成的应用场景中。

应用领域

TLV6001IDCKR广泛应用于多个领域,包括:

  • 便携式设备:如移动电话、手持式仪器和便携式传感器的信号处理。
  • 医疗仪器:如心电图(ECG)和生物信号监测等医疗设备中的信号放大。
  • 传感器接口:特别是用于气体、温度、压力和其他物理量传感器的信号放大和信号调理。
  • 数据采集系统:TLV6001可用于采集系统中的模拟信号放大,确保高精度数据捕获。
  • 音频应用:用于音频信号的处理和放大,满足高音质输出的需求。

总结

TLV6001IDCKR作为一款高性能、低功耗的单路运算放大器,结合其卓越的技术规格和灵活的应用场景,成为设计师在面对复杂电路设计时的重要选择。其性能的可靠性和稳定性,以及在各种极端环境下的适应能力,使其在现代电子产品设计中占据了重要地位。无论是在新兴的传感器技术中,还是在改进传统设备的性能上,TLV6001IDCKR都是实现目标的理想解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.