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TI TLV70019DDCR
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TI(Texas Instruments) TLV70019DDCR
- Type
- TI
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- 48uVrms
- Electronic Component
- TLV70019DDCR
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0227583290
- Operating Temperature
- 40℃~+125℃@(Tj)
- Operating Voltage
- 5.5V
- Output
- Electronic Component
- Output Voltage
- 1.9V
- Output Current
- 200mA
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLV70019DDCR 产品概述
一、核心特性
TLV70019DDCR 是德州仪器（TI）推出的一款固定输出线性稳压器（LDO），输出电压为 1.9V，面向需要低静态电流与低噪声的便携与精密模拟应用。器件为正极输出、单通道设计，最大输出电流可达 200mA，适合为MCU、传感器和射频前端等供电。
二、主要参数一览
- 输出类型：固定输出（1.9V）
- 最大工作电压（Vin）：5.5V（器件额定）
- 最大输出电流：200mA
- 静态电流（Iq）：31 μA（典型）
- 输出噪声：48 μVrms
- 电源纹波抑制比（PSRR）：68 dB @ 1 kHz
- 工作温度范围（Tj）：-40 ℃ 至 +125 ℃
- 保护特性：过流保护、热关断
- 封装：SOT-23-5
- 品牌：TI（德州仪器）
三、保护与可靠性
TLV70019DDCR 集成过流限制与热关断功能，可在短路或过载情况下保护器件与系统，提升可靠性。工作温度覆盖广泛的工业级范围，适用于多种环境与长期工作场景。
四、封装与热管理
SOT-23-5 小封装便于紧凑电路板布局，但在高负载（接近200mA）或高环境温度下需注意散热。建议在PCB布局时使用较大面积的接地铜箔或热散区域，提高散热能力，保证长期稳定工作。
五、典型应用
- 电池供电的便携设备与物联网终端
- 传感器供电与数据采集前端（需低噪声）
- MCU、FPGA 或外设电源轨（需要稳定 1.9V）
- 射频前端与模拟电路（受益于高 PSRR 与低噪声性能）
六、使用建议与布局要点
- 输出侧应配合低ESR陶瓷电容以保证稳态与瞬态响应（遵循TI推荐的COUT范围与布局规范）。
- 输入端加旁路电容以提高纹波抑制与瞬态性能。
- 将输入/输出电容尽量靠近器件引脚放置，缩短走线并通过多点接地减少回路阻抗。
- 注意器件在高功耗条件下的热设计，必要时在PCB上扩展散热铜箔。
七、产品优势小结
TLV70019DDCR 在低静态电流、良好PSRR与低噪声之间提供了平衡，适合对电池寿命、模拟性能和电源纯净度有较高要求的系统设计。SOT-23-5 封装使其易于在空间受限的产品中采用，同时集成保护功能提升系统鲁棒性。
如需器件引脚定义、典型电路或更详细的布局与电容选择建议，可参考TI官方数据手册以获得完整应用指导与参数曲线。
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