WMSIC Electronic Components

TI LMR38010SDDAR

ModelLMR38010SDDAR
PackageSOPowerPAD-8
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) LMR38010SDDAR
Type
TI
Minimum package
2500

Technical parameters

Electronic Component
TI(Texas Instruments)
Electronic Component
LMR38010SDDAR
Electronic Component
1
Package
SOPowerPAD-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.183g
Electronic Component
1
Features
Frequency Synchronous;;; EMI Optimization
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227624147
Operating Temperature
40℃~+150℃@(TJ)
Operating Voltage
4.2V~80V
Switching Frequency
200kHz~2.2MHz
Electronic Component
Electronic Component
Output Voltage
1V~75V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMR38010SDDAR 产品概述

一、产品简介

LMR38010SDDAR 是 TI SIMPLE SWITCHER® 系列的一款高压降压型开关稳压器,集成功率开关管,支持宽输入电压范围 4.2V 至 80V,最大输出电流 1A,开关频率可在 200kHz 至 2.2MHz 范围内工作(可通过器件配置调整)。器件封装为 SOPowerPAD-8,工作结温范围 -40℃ 至 +150℃,静态电流仅 40µA,支持同步整流并提供可调输出,适合对体积、效率和高压容忍有要求的应用。

二、主要规格(一览)

  • 功能类型:降压(Buck)
  • 输入电压:4.2V ~ 80V
  • 输出电流:1.0A(持续)
  • 开关频率:200kHz ~ 2.2MHz(可配置)
  • 同步整流:内置(提高轻载效率)
  • 静态电流:约 40µA
  • 输出类型:外部反馈电阻可调输出电压
  • 封装:SOPowerPAD-8(带散热焊盘)
  • 工作结温:-40℃ ~ +150℃(TJ)

三、器件特点与优势

  • 宽输入电压能力(高达 80V),适合 48V/24V 工业、通信和汽车后备/转换场景;也可直接由电池组或高压供电降压。
  • 内置同步开关,减少整流损耗,提高中高负载下效率;静态电流低,轻载或待机功耗小。
  • 可调开关频率覆盖 200kHz~2.2MHz,用户可在开关损耗与外部器件体积之间灵活权衡:高频可减小电感与电容体积,低频可降低开关损耗和热量。
  • SOPowerPAD-8 封装带大面积散热焊盘,有利于热传导到 PCB,提升功耗处理能力和稳定性。

四、应用场景与选型建议

  • 典型应用:工业自动化(传感器、驱动电源)、通信设备、电源管理模块、分布式电源、48V/24V 到低压轨(如 5V/3.3V/1.8V)转换等。
  • 选型要点:若系统输入最大电压接近 80V,应重点考虑器件热耗与 PCB 散热;若追求最小尺寸可选高频工作点,但要注意效率下降与温升。输出 1A 适合为中小功率模块供电,若需更大电流应并联或选用更大额定器件。

五、设计与布局要点

  • 输入侧使用低 ESR 电容,且靠近 VIN 引脚布置以抑制尖峰与振荡;输入电容需满足高压耐压要求。
  • 输出电感需选额定电流 >1A 的低 DCR 器件并考虑饱和裕量;电容选择同样关注 ESR 与纹波电流能力。
  • 高电流回路(开关节点、输入/输出回路)需尽量短且直接,减少环路面积以降低 EMI。
  • SOPowerPAD 的焊盘必须良好连接到 PCB 大铜箔并接地散热,必要时在底层多层铜铺设以提升散热能力。
  • 参考 TI 数据手册中的补偿、启动与布局范例,验证热性能与保护行为。

六、后续参考

建议下载 TI 官方数据手册和参考设计,核对保护(如限流、热关断、欠压闭锁)及频率设定方法的具体细节,并在目标系统中做温升、效率与稳定性验证。若需替代器件或并联方案,可以根据输入电压、输出电流与效率要求进一步比较。

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