WMSIC Electronic Components

TI TL431CDBZR

ModelTL431CDBZR
PackageSOT-23-3
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) TL431CDBZR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
TL431CDBZR
Electronic Component
1
Package
SOT-23-3
Electronic Component
Voltage Reference IC
Electronic Component
±2%
Electronic Component
0.05g
Electronic Component
1
Electronic Component
BM0058431891
Operating Temperature
0℃~+70℃
Operating Voltage
2.5V~36V
Output Voltage
2.5V~36V
Output Current
100mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TL431CDBZR 产品概述

概述

TL431CDBZR 是德州仪器(Texas Instruments)推出的一款高性能可调式电压基准芯片,采用表面贴装封装SOT-23-3。该元器件广泛应用于电源管理、精密电压参考和线性稳压器等电路设计中。作为一款具有低噪声和高稳定性的电压基准芯片,TL431CDBZR 提供用户一系列电压输出范围,供设计师在各种应用中选择。

主要特点

  • 可调输出电压范围:输出电压可调范围为 2.495V 至 36V,适用于多种应用场合。
  • 最大输出电流:能够提供高达 100mA 的输出电流,确保电路在高负载条件下运行。
  • 高精度:产品的电压容差为 ±2.2%,极大地提升了系统的整体精度。
  • 低阴极电流:典型阴极电流为 1mA,降低了功耗,使其在低功耗应用中表现尤为出色。
  • 工作温度范围:TL431CDBZR 工作温度范围为 0°C 至 70°C,适合一般环境下的应用。
  • 表面贴装型封装:SOT-23-3 封装使其便于在自动化生产中使用,同时也占用更小的电路板空间。

应用场合

TL431CDBZR 具备广泛的应用可能性,适用于以下领域:

  1. 电源供应:在开关电源和线性稳压器中应用,提供稳定的电压参考。
  2. 信号调节:可用于信号调节电路,保证信号电压的稳定输出。
  3. LED驱动:适合用于 LED 驱动电路,确保 LED 输出电流的稳定性。
  4. 电池充电器:可作为电池充电器中的电压参考源,保证充电过程的安全性和稳定性。
  5. 传感器供电:为各种传感器供电环境提供稳定的参考电压。

性能优势

与其他电压基准芯片相比,TL431CDBZR 具有以下性能优势:

  • 高输出电流能力:在需要较大输出电流的应用场合中,TL431CDBZR 的 100mA 输出能力能够有效支持。
  • 优秀的温度稳定性:在不同的工作温度范围内保持高精度,确保设计拥有良好的可靠性。
  • 设计灵活性:可调输出电压使得设计师能够根据具体需求进行灵活的调整,不再拘泥于固定输出电压的限制。
  • 易于集成:小尺寸的 SOT-23-3 封装使其容易集成到各种电路板上,有助于减小产品的整体尺寸。

结论

TL431CDBZR 是一款功能强大且灵活的可调电压基准芯片,适用范围广泛,性能稳定,是设计师在电源管理和信号调节等应用中不可或缺的理想选择。作为德州仪器的高质量产品,其优越的性能和可靠性定能满足严苛的工业标准和各种设计需求。无论是在低功耗系统还是高精度应用中,TL431CDBZR 都能为设计师提供强大的支持与保障。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.