WMSIC Electronic Components

TI SN74LXC1T14DCKR

ModelSN74LXC1T14DCKR
PackageSC-70-5
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) SN74LXC1T14DCKR
Type
TI
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LXC1T14DCKR
Electronic Component
1
Package
SC-70-5
Electronic Component
Converter / Level positions
Electronic Component
0.033g
Electronic Component
1
Electronic Component
1
Features
Output
Electronic Component
BM0227583262
Operating Temperature
40℃~+125℃
Data
420Mbps
Signal
CMOS
Output Signal
CMOS
Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LXC1T14DCKR 产品概述

一、概述

SN74LXC1T14DCKR 是德州仪器(TI)推出的一款单通道、固定方向的反相电平变换器/缓冲器,适用于 1.1 V 至 5.5 V 范围内的电平转换与信号整形场合。器件采用 SC-70-5 小封装(TI 封装代码 DCKR,带卷包装),单通道设计、推挽输出(CMOS 输出级),具备断电保护功能,工作温度范围为 -40 °C 到 +125 °C,数据速率可达 420 Mbps,适合中高速数据信号的双电压域互连与接口隔离。

二、主要特性

  • 输出类型:推挽式(推/拉 CMOS 输出)
  • 信号方向:固定方向(单向,反相)
  • 功能:电平转换 + 反相
  • 断电保护:支持侧式断电或部分电源为 0 V 时的保护,避免对被连接器件进行反向供电(reduce back-drive)
  • 通道数:1(单路)
  • 通道类型:单向(不可双向自动翻转)
  • 输入/输出信号电平:CMOS 兼容
  • VCCA:1.1 V ~ 5.5 V
  • VCCB:1.1 V ~ 5.5 V
  • 数据速率:420 Mbps(典型,视系统布局与负载而定)
  • 工作温度:-40 °C ~ +125 °C
  • 封装:SC-70-5(微小型塑料封装,适合高密度布板)

三、典型应用场景

  • 不同电压域微控制器/FPGA 与外设之间的电平接口(如 1.8 V ↔ 3.3 V、2.5 V ↔ 5.0 V)
  • 单向高频串行链路的反向缓冲与驱动
  • 低功耗/便携式设备中的电源域隔离与信号传递
  • 接口保护:热插拔、上电顺序不确定时防止反向供电
  • 数字信号整形:清理毛刺并提供稳定的逻辑反相输出

四、设计考虑与使用建议

  • 电源连接:器件在 VCCA 与 VCCB 两侧分别供电,可实现不同电压域之间的信号转换。务必在 PCB 上将去耦电容(例如 0.01 μF 至 0.1 μF)靠近 VCCA 与 VCCB 引脚布置,以抑制瞬态噪声。
  • 输入信号:输入为 CMOS 兼容,宜保证输入信号在器件规定的电平范围内,避免超出评分(尤其是对 ESD 保护结构的应力)。
  • 布线与终端:当接近 420 Mbps 时,建议控制阻抗、缩短走线并在必要时使用阻容终端或 22–50 Ω 串联阻抗进行阻抗匹配,以减少反射与高频振铃。
  • 断电保护:尽管器件具备断电保护特性,但在多电源系统中仍建议遵守上电/断电序列规范,并避免长期将一侧电源悬空带电连接大电流负载。
  • 热管理:SC-70-5 为小封装,长期大电流或高频率开关会引起局部温升,设计时留意功耗预算与周边散热条件。
  • ESD 与 EMI:在高干扰环境中,增加 TVS 或滤波器可提升系统可靠性;敏感信号走线应远离开关式电源噪声源。

五、封装与采购信息

  • 封装形式:SC-70-5(超小型 5 引脚封装,适合 BGA/紧凑 PCB 设计)
  • TI 封装代码:DCKR(通常表示该封装及带卷包装形式)
  • 订购型号示例:SN74LXC1T14DCKR(详细订购信息请参考 TI 官方数据手册与库存页面)

六、选型与替代建议

在选型时,如需更多通道、双向自动方向控制或更高数据速率,可考虑 TI 其他系列或同类厂商的电平移位器/缓冲器。但若设计要求为:单路反相、可在 1.1 V–5.5 V 范围内任意两侧电压配对、推挽输出且要求断电保护与小体积封装,SN74LXC1T14DCKR 为简洁、低占位的合适选择。

总结:SN74LXC1T14DCKR 提供单通道、固定方向的反相电平转换与推挽输出,覆盖宽电压范围并具备断电保护,非常适合在空间受限且需跨电压域互连的中高速数字系统中作为可靠的接口器件。 若需更详细的电气参数(阈值、电阻、功耗曲线等),建议参考 TI 官方数据手册和器件规范表以完成最终硬件设计。

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