WMSIC Electronic Components

TI SN65HVD72DRBR

ModelSN65HVD72DRBR
PackageSON-8(3x3)
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) SN65HVD72DRBR
Type
TI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN65HVD72DRBR
Electronic Component
1
Package
SON-8(3x3)
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.06g
Electronic Component
213
Electronic Component
1
Features
Tx / Rx
Electronic Component
BM0230007146
Operating Temperature
40℃~+125℃
Operating Voltage
3V~3.6V
Receiver
1
Data
250Kbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN65HVD72DRBR 产品概述

一、简介

SN65HVD72DRBR 是德州仪器(TI)推出的一款 RS‑485/RS‑422 差分收发器,单驱动器、单接收器,工作于半双工通信模式。器件工作电源为 3.0 V ~ 3.6 V,典型数据速率可达 250 kbps,支持多节点总线接入,节点数可达 213。器件耐静电能力为 ±8 kV(人体模型),工作温度范围为 -40 ℃ ~ +125 ℃,静态电流约为 950 µA,封装为 SON‑8 (3×3)。

二、主要特性

  • 单驱动器 / 单接收器,支持 RS‑485/RS‑422 差分通信(半双工)。
  • 供电电压:3.0 V ~ 3.6 V,适用于 3.3 V 系统。
  • 数据速率:最高可达 250 kbps,满足常见工业总线速率需求。
  • 总线节点:最多可支持 213 个节点,适合大规模分布式网络。
  • 低静态电流:典型静态电流 950 µA,有利于节能设计。
  • 工业级温度:-40 ℃ ~ +125 ℃,适合恶劣环境。
  • ESD 抗扰度:±8 kV(人体模型)。
  • 封装:SON‑8 (3×3),节省 PCB 面积。

三、适用场景与优势

该收发器适用于工业自动化、楼宇控制、仪表抄表、楼宇安防、现场总线节点、传感器/执行器接口等需要长距离、抗干扰和多节点接入的差分通信场合。其低静态功耗与工业温度等级,使之在低功耗与高可靠性并重的系统中具有优势。半双工设计便于实现总线式多点通信,减少布线复杂度。

四、设计与使用建议

  • 终端匹配:在总线两端采用差分终端电阻(典型值 100 Ω ~ 120 Ω)以匹配电缆特性,减少反射。
  • 偏置与失效保护:在长线或多节点系统应设置偏置电阻(pull‑up / pull‑down)以保证空闲总线的确定电平,避免收发器误触发。
  • 总线仲裁:在半双工网络中通过驱动器使能信号合理管理发送时隙,避免总线争用和冲突。
  • 去耦与布线:在 VCC 和 GND 之间靠近器件放置 0.1 μF 陶瓷去耦电容;差分线对布线尽量短且并行、保持恒定阻抗,避免与高速或噪声源平行走线。
  • 保护措施:器件已具备一定 ESD 抗扰能力,但若接口直连外部环境(长缆、野外安装)建议额外增加 TVS 或保护网络以提升可靠性。
  • 热与可靠性:在高温或高密度 PCB 布局下注意散热与焊接工艺,遵循制造商封装说明。

五、封装与获取

封装型号:SON‑8 (3×3)。订购时以完整料号 SN65HVD72DRBR 为准,建议参照 TI 官方数据手册获取详细的电气特性、引脚定义、时序和典型应用电路,以便在具体设计中验证时序、驱动能力与容限。

如需参考电路示意或在特定应用(如长距离抄表、多节点实时网络)中优化参数,我可以提供更具体的布线与偏置方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.