Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TI REF2930AIDBZR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) REF2930AIDBZR
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- REF2930AIDBZR
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Voltage Reference IC
- Electronic Component
- ±2%
- Electronic Component
- 0.05g
- Electronic Component
- 1
- Electronic Component
- BM0000003906
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 3.05V~5.5V
- Electronic Component
- 100ppm/℃
- Output Voltage
- 3V
- Output Current
- 25mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
REF2930AIDBZR 产品概述
概述
REF2930AIDBZR 是一款高精度、低噪声的电压参考芯片，属于德州仪器（Texas Instruments, TI）的电压基准系列。该芯片设计用于提供稳定的输出电压，适合需要高精度和低漂移的应用场景。它可以固定输出3V的电压，并支持25mA的输出电流，广泛应用于数据采集、信号处理、仪器仪表等领域。
主要性能参数
- 输出类型: 固定
- 输出电压: 3V（最小值/固定）
- 最高输出电流: 25mA
- 输入电压范围: 3.05V 至 5.5V
- 供电电流: 59µA（低功耗设计）
- 容差: ±2%
- 温度系数: 100ppm/°C
- 工作温度范围: -40°C 至 125°C
噪声性能
REF2930AIDBZR 具备极低的噪声特性。在0.1Hz至10Hz的频率范围内，其输出噪声仅为33µVp-p，而在10Hz至10kHz的频率范围内，输出噪声为94µVrms。这种低噪声特性使其非常适用于对信号完整性要求较高的应用中，例如高精度数据采集模块和传感器接口电路。
封装和安装
该电压基准芯片采用SOT-23-3封装，支持表面贴装型（SMD）安装。这种尺寸小巧的封装模式，方便了在空间受限的电路板上的布局和集成。同时，SOT-23-3封装也有助于提高整体的电路性能，因为其短引线和紧凑设计能减少布局引入的阻抗和噪声。
应用场景
REF2930AIDBZR 适用于许多需要稳定参考电压的场景，包括但不限于：
- 数据采集系统
- 传感器信号调理
- 电压基准源
- 放大器和比较器电路
- 工业自动化和控制系统
性能优势
REF2930AIDBZR的设计体现了多项性能优势：
- 高精度: 常见的±2%容差使其适合绝大多数对电压基准有严格要求的应用。
- 优异的温度稳定性: 在广泛的工作温度范围内，提供可靠的输出电压，确保每个工作条件下的性能一致性。
- 极低功耗: 供电电流仅为59µA，特别适合于对功率和电池寿命有严格要求的便携式设备。
- 宽输入电压范围: 3.05V到5.5V的宽广输入电压范围，提高了设计灵活性，能够适应多种供电需求。
结论
综上所述，REF2930AIDBZR是一款卓越的固定电压基准芯片，凭借其高精度、低噪声和出色的温度稳定性，成为各种精密电子设备的理想选择。无论是在工业控制、传感器应用还是便携式电子产品中，该电压参考芯片都能提供可靠的电压输出，满足严格的性能标准，是现代电子设计的必备元件之一。通过选用REF2930AIDBZR，设计人员可以确保他们的系统具有稳定性和准确性，从而提升整体性能和用户体验。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
