Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM258DRG4 是德州仪器(Texas Instruments)生产的一款双通道通用运算放大器(Op-Amp)。该产品采用表面贴装型封装(8-SOIC),适用于各种电子电路的信号处理和增幅应用,主要特性包括700kHz的增益带宽积(GBW)、0.3V/µs的压摆率(slew rate)以及极低的输入偏置电流(20nA),使得 LM258DRG4 在低功耗应用中表现优秀。
安装类型:表面贴装型。这种安装方式有助于提高电路板的空间利用率,同时也使得自动化生产更加高效。
电路数:双路,意味着 LM258DRG4 内部集成了两个独立的运算放大器,这使得其可以用于需要多通道信号处理的应用场景。
增益带宽积:700kHz。增益带宽积是运算放大器性能的重要参数,其数值越大,意味着在更高频率下仍能保持较高的增益。LM258DRG4 的GBW适合用于中频段信号处理。
压摆率:0.3V/µs。该参数指示了输入信号变化时,输出信号速率的响应能力。压摆率较低限制了使用场景,但对于需要相对缓慢变化的信号处理如传感器信号放大等应用是足够的。
电流 - 输入偏置:20nA。该特性反映了运算放大器对输入信号源的负载能力,较低的偏置电流使其在高阻抗信号源中表现良好,最小化了对源信号的影响。
电流 - 供电:1mA。该器件功耗低,适用于移动设备和其他需要低功耗设计的应用。
工作温度:-25°C ~ 85°C。LM258DRG4 可以在相对广泛的环境温度条件下稳定工作,对于多种工况下的设备来说都有良好的适应性。
电压供电: 单/双电源范畴为3V ~ 32V,±1.5V ~ 16V。支持广泛的供电电压范围使得 LM258DRG4 能够在各种电源环境下运作,无论是低电压应用还是标准电源供应场合。
LM258DRG4 的特性使其成为多种电子设备中的理想选择,特别适合以下应用:
传感器信号处理:因其低输入偏置电流,非常适合用于连接高阻抗传感器和需处理的信号。
音频放大:适用于音频信号的放大,虽然其压摆率较低,但音频信号变化缓慢,可以在该范围内正常工作。
数据采集系统:为许多测量和数据采集应用提供信号调理,尤其是在较高精度要求下,也能够有效放大微弱信号。
信号调理电路:可以用于滤波器、积分器、微分器等的设计,再加上其两通道的特性,使得在复杂电路中的应用灵活多样。
LM258DRG4 是一款性能稳定、适应性强的双路通用运算放大器。其设计旨在满足多种应用需求,从而符合现代电子设备对低功耗、高效率及灵活性的要求。无论是工业应用还是消费电子,LM258DRG4 都能提供可靠的性能表现,值得设计师和工程师们在设计时考虑使用。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products