WMSIC Electronic Components

TI ESD762DBZR

ModelESD762DBZR
PackageSOT-23(DBZ)|3
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

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Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) ESD762DBZR
Type
TI
Minimum package
3000 未知

Technical parameters

Electronic Component
CUT TAPE
Electronic Component
TI(Texas Instruments)
Electronic Component
ESD762DBZR
Electronic Component
1
Package
SOT-23(DBZ)|3
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.032g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
1.7pF
Electronic Component
BM0263519270
Operating Temperature
55℃~+150℃
Voltage
36V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD762DBZR 产品概述

一、主要特点

ESD762DBZR 是 TI(德州仪器)推出的一款双路双向瞬态抑制二极管,专为高可靠性静电和浪涌防护而设计。主要参数包括:反向截止电压 Vrwm = ±24 V、钳位电压约 36 V、峰值脉冲电流 Ipp = 2.5 A(8/20 μs)、峰值脉冲功率 Ppp = 90 W(8/20 μs)、结电容 Cj = 1.7 pF,反向漏电流 Ir ≈ 50 nA,工作温度范围 -55 ℃ ~ +150 ℃,满足 IEC 61000-4-2(ESD)与 IEC 61000-4-5(浪涌)规范。器件采用 SOT-23(DBZ)小封装,适合空间受限的电路板设计。

二、功能简介

该器件为双通道、双向保护结构,能够在信号线正负极出现瞬态高电压时快速钳制,吸收能量并将过电压限制在安全范围,保护下游敏感器件不被破坏。8/20 μs 浪涌参数表示在工业浪涌测试条件下器件的承受能力,±20 kV 表示对接触/空气放电类高能 ESD 的强化保护能力。

三、关键参数详解

  • 双向(±24 V)特性:适用于无固定极性的信号或可能出现反向电压的接口。
  • 钳位与浪涌能力:在 8/20 μs 浪涌下,器件能承受峰值脉冲电流 2.5 A,并将电压钳位在约 36 V,瞬态功率可达 90 W。
  • 低结电容(1.7 pF):对高速、高带宽信号影响小,适于串行总线和射频/高速数据信号的保护。
  • 低漏电(≈50 nA)与宽温度范围:在保持保护性能的同时,减少对电路偏置的影响,适用于工业级和车规级环境(温度 -55 ℃ 至 +150 ℃)。

四、典型应用场景

  • 高速数据接口:USB、HDMI、LVDS 等高速差分信号线的端口保护(尤其要求低结电容时)。
  • 工业通信与控制接口:RS-485、CAN、差分模拟信号链路以及需要耐受较高工作电压的 I/O。
  • 便携及消费电子设备:用于靠近外部连接器的 PCB 抗静电设计。
  • 电源与控制线的瞬态保护:当工作电压不超过 ±24 V 时,可作为浪涌保护单元。

五、封装与 PCB 布局建议

  • 器件采用 SOT-23(3 引脚)小封装,双通道集成,便于节省 PCB 面积。
  • 推荐将 ESD762DBZR 放置在被保护接口附近,尽量缩短受保护线到器件引脚的走线长度,以降低感抗和提高响应速度。
  • 对于地/参考电位,使用多通孔(vias)将器件接地引脚快速连到内部地平面,保证浪涌能量有效散流。
  • 在差分信号应用中,注意走线对称并避免跨越敏感器件布线。

六、可靠性与选型建议

  • 器件符合 IEC 61000-4-2 与 IEC 61000-4-5 标准,适用于要求工业级抗扰度的设计。
  • 选型时应根据最大工作电压、信号带宽、容忍的钳位电压及环境温度来评估;若系统需承受更高脉冲电流或更低钳位电压,可考虑并联或选用更高能量规格的 TVS 器件。
  • 在高频或超高速应用,1.7 pF 的结电容通常对信号影响较小;但对超高速度(数 GHz 级)仍需评估时域/频域影响。

ESD762DBZR 提供了在体积受限场合下兼顾低电容与高能量吸收能力的解决方案,是保护双路高速/工业接口的可靠选择。

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