WMSIC Electronic Components

TI LP5907UVX-1.8/NOPB LP5907UVX

ModelLP5907UVX-1.8/NOPB
PackageDSBGA-4
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) LP5907UVX-1.8 / NOPB
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
120mV@(250mA)
Electronic Component
TI(Texas Instruments)
Electronic Component
6.5uVrms
Electronic Component
LP5907UVX-1.8/NOPB
Electronic Component
1
Package
DSBGA-4
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.029g
Electronic Component
1
Features
Output
Electronic Component
BM0259466038
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP5907UVX-1.8/NOPB 产品概述

一、概述

LP5907UVX-1.8/NOPB 是德州仪器(TI)推出的一款超低噪声、低静态电流的线性稳压器(LDO),提供固定 1.8V 输出,最大输出电流 250mA。器件支持最高输入电压 5.5V,采用超小型 DSBGA-4 封装,适合对噪声、功耗和空间有严格要求的便携和电池供电应用。典型应用包括移动设备、射频前端、传感器供电和低噪声模拟电路等。

二、关键参数

  • 输出类型:固定(1.8V)
  • 最大输入电压:5.5V
  • 输出电流:最高 250mA
  • 压差(dropout):约 120mV @ 250mA
  • 静态电流(Iq):约 12 µA(典型值)
  • 电源纹波抑制比(PSRR):82 dB @ 1 kHz
  • 输出噪声:6.5 µVrms(典型)
  • 工作温度范围:-40 ℃ ~ +125 ℃(Tj)
  • 保护功能:短路保护、过热关断(热关断)、欠压锁定(UVLO)
  • 使能功能:带使能引脚(可实现软启与电源控制)
  • 输出极性/通道数:单通道、正输出
  • 封装:DSBGA-4(小尺寸 BGA)

三、主要特性与优势

  • 超低噪声:6.5 µVrms 的低噪声性能,适合敏感模拟与 RF 前端供电,能有效降低电源引入的噪声干扰。
  • 高 PSRR:在 1 kHz 附近 82 dB 的 PSRR,有利于抑制上游开关电源或噪声源的纹波传递。
  • 低静态电流:12 µA 的静态工作电流非常适合电池供电与低功耗系统,待机功耗低。
  • 低压差:120 mV 的压差在高负载下仍能保持较高的效能,便于使用较低差分电压的电池系统。
  • 完善的保护:短路保护与热关断提高系统可靠性,欠压锁定与使能引脚方便电源管理与电源顺序控制。
  • 小尺寸封装:DSBGA-4 体积小,利于空间受限的 PCB 设计。

四、典型应用场景

  • 智能手机与便携式终端的基带/模拟子电路供电
  • 射频前端与低噪声放大器(LNA)电源
  • 传感器、数据采集模数前端(ADC、放大器)供电
  • 电池供电设备、可穿戴设备和物联网终端
  • 需要高 PSRR 与低输出噪声的工业与医疗仪器

五、布局与电气设计建议

  • 输出与输入端各放置至少 1 µF 陶瓷去耦电容(建议 X5R 或 X7R),以保证稳压器稳定和最佳瞬态响应。陶瓷电容应放置在器件引脚附近,走线尽量短。
  • 对于 DSBGA-4 小封装,请在 PCB 底层或附近提供充足的地平面,确保良好的散热与低阻抗接地。
  • 若系统有较强的地噪声或长输入线,建议在输入端加 1 µF 陶瓷电容并辅以适当的滤波网络(如 RC、LC)以进一步降低高频干扰。
  • 使能(EN)引脚应通过可靠的逻辑或上拉/下拉电路控制,必要时可实现软启功能以减少上电冲击。

六、封装与热管理

DSBGA-4 封装体积小,热阻相对较高,热管理依赖于 PCB 的散热设计。建议在 PCB 底层或内层增加铜箔、热过孔(thermal vias)与地平面,形成良好的散热路径,确保在接近最大输出电流或高环境温度下仍能维持稳定工作并满足结温限制。

七、使用注意事项与可靠性

  • 器件在高负载或高结温条件下可能触发热关断,设计时应考虑功耗分布与散热措施。
  • 输出电容类型与大小对稳态与动态特性影响显著,优先使用低 ESR 的多层陶瓷电容并靠近器件放置。
  • 在高精度或低噪声应用中,注意 PCB 布线、接地策略以及输入电源品质,以发挥 LP5907 的低噪声和高 PSRR 优势。

小结:LP5907UVX-1.8/NOPB 将低噪声、高 PSRR、低静态电流与小封装结合,适合对噪声敏感并对能耗、体积有严格要求的便携与工业应用。在遵循推荐去耦与 PCB 散热实践下,能够为 1.8V 电源轨提供稳定、可靠的供电保障。

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