WMSIC Electronic Components

TI TLV62595DMQR

ModelTLV62595DMQR
PackageVSON-6(1.5x1.5)
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) TLV62595DMQR
Type
TI
Unit
Electronic Component
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
TLV62595DMQR
Electronic Component
1
Package
VSON-6(1.5x1.5)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.016g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227583329
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.5V~5.5V
Switching Frequency
2.2MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLV62595DMQR 产品概述

一 主要功能与定位

TLV62595DMQR 是德州仪器(TI)推出的一颗高效率降压型(Buck)DC-DC 开关稳压器,适用于从 2.5V 到 5.5V 的输入电压范围,将电压转换为可调输出(600mV 至 4.0V),并能提供最高 4A 的连续输出电流。器件集成同步整流与开关管,采用高频(2.2MHz)工作频率,适合对体积与EMI 有较严格要求的电源设计场合。

二 关键参数

  • 功能类型:降压型(同步整流)
  • 输入电压:2.5V ~ 5.5V
  • 输出电压:可调 600mV ~ 4.0V
  • 最大输出电流:4A
  • 开关频率:2.2MHz
  • 静态电流(Iq):10 µA(轻载低漏电消耗)
  • 工作温度范围:-40℃ ~ +125℃(以结温 TJ 表示)
  • 开关管:内置(器件内集成高/低侧 MOSFET)
  • 输出通道数:1 路
  • 封装:VSON-6(1.5 mm × 1.5 mm)
  • 输出类型:可调

三 优势与特性

  • 高频工作(2.2MHz)有利于使用小型电感与陶瓷输出电容,从而减小 PCB 面积与整体体积;
  • 同步整流提高轻载及中高负载下的转换效率,适合电池供电与便携设备;
  • 极低静态电流(10µA)有助于降低待机能耗,延长电池寿命;
  • 宽输入及可调输出电压范围,适配多种电源轨需求(MCU、无线模块、传感器等)。

四 推荐应用

  • 手持终端与便携式设备电源管理;
  • 单节或多节锂电池系统的降压轨;
  • MCU、DSP、FPGA 的电源前端;
  • 无线通信模块与传感器供电;
  • 工业/汽车级电子系统中要求小体积高效能的电源模块(在符合温度与可靠性要求下)。

五 封装与热管理注意

TLV62595DMQR 为 VSON-6(1.5×1.5mm)超小封装,适合高密度 PCB 设计。由于封装体积小,散热能力受限,实务中应注意:

  • 在 PCB 布局时为器件底部及附近的铜箔留足散热面积;
  • 将电感、输入/输出电容合理放置以最小化环路面积;
  • 对大电流场合评估结温升并验证在最大负载及高环境温度下的热裕度。

六 使用建议与注意事项

  • 严格按照器件数据手册推荐的布局与外部元件(电感、电容、反馈电阻)值进行设计,以保证稳定性与效率;
  • 输入端使用低 ESR 陶瓷电容抑制开关尖峰,输出端选型时兼顾纹波与瞬态响应;
  • 在高电流工作状态下,评估 PCB 温升并必要时增加散热措施或改变布局;
  • 对于 EMI 要求较高的应用,可在输入端增加滤波与合理走线以降低辐射。

七 订购信息与后续

器件型号:TLV62595DMQR,品牌:TI(德州仪器),封装:VSON-6(1.5×1.5)。在开展样机设计前,请参考 TI 官方数据手册、参考设计与评估板资料,确认最终电气参数、BOM 建议与布局范例,以保证产品性能与可靠性。

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