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CUS08F30,H3F(T CUS08F30
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TOSHIBA CUS08F30, H3F(T
- Type
- TOSHIBA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- CUS08F30,H3F(T
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- BM0227154632
- Current
- 800mA
- Current(Ir)
- 50uA@30V
- (Vf)
- 450mV@800mA
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
- Surge Current (Ifsm)
- 5A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CUS08F30,H3F(T) 产品概述
一、产品简介
CUS08F30,H3F(T) 为东芝（TOSHIBA）出品的小信号肖特基二极管，采用SOD-323小封装，面向需要低正向压降和高速恢复的整流/保护场合。其典型正向压降为 Vf = 450 mV（在 IF = 800 mA 时），直流反向耐压 Vr = 30 V，额定整流电流 IF（连续）为 800 mA，反向漏电流 Ir ≤ 50 μA（在 Vr = 30 V 时），非重复峰值浪涌电流 Ifsm 可达 5 A，适合空间受限且强调效率与响应速度的设计。
二、主要参数要点
- 型号：CUS08F30,H3F(T)（TOSHIBA）
- 封装：SOD-323（小型表面贴装）
- 正向压降：Vf = 450 mV @ IF = 800 mA
- 额定整流电流：IF = 800 mA（连续）
- 直流反向耐压：Vr = 30 V
- 反向漏电流：Ir ≤ 50 μA @ Vr = 30 V
- 非重复峰值浪涌电流：Ifsm = 5 A
- 结构：肖特基势垒，低势垒电压、快恢复
三、典型应用
- 开关电源与DC-DC变换器中的输出整流（中低电流场合）
- 反并联续流（freewheeling）二极管用于功率开关器件保护
- 电源输入反向保护、极性保护电路
- 信号钳位、检测电路及高频整流场合
四、性能优势与限制
优势：低正向压降可降低导通损耗、提高效率；肖特基结构响应快、开关损耗小；小尺寸封装便于高密度布板。限制：SOD-323 散热能力受限，连续大电流下需注意结温；反向漏电在高温下会增大，不适用于高耐压或高漏电敏感的应用。
五、电路与热设计建议
- 布线尽量缩短正负回路，减少寄生电阻和感抗；贴近封装设置旁路电容与磁环。
- 若连续接近额定 IF 工作，应评估结温与PCB散热（加宽铜箔、必要时加散热垫或多个过孔）。
- 浪涌情况（Ifsm）仅为非重复峰值，避免频繁或长时间的冲击电流。
- 对于反向漏电敏感应用，可在实际温度下测量 Ir 并预留余量。
六、封装与焊接注意事项
遵循东芝推荐的焊接回流曲线及SMD工艺规范，避免超温/超时的氧化和翘曲。小封装在回流时易受热，应控制回流峰值与加热速率；在拆焊或手工焊接时注意局部过热可能损伤器件性能。
七、选型与替代建议
如需更高Vr或更低Vf可考虑其他肖特基型号或不同封装；若需要更强散热能力，应选用功率型封装（SOD-123、SOD-128、DO-214等）或并联多颗器件时小心电流分配和平衡。
总结：CUS08F30,H3F(T) 以低Vf、快响应与小尺寸为核心优势，适合中低功率、高密度电源及保护电路；在设计时应综合考虑热管理和反向漏电对系统的影响，以确保长期可靠性与性能稳定。
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