Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TLP292-4(-TP,E(T TLP292
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TOSHIBA TLP292-4(GB-TP, E(T
- Type
- TOSHIBA
- Minimum package
- 2000 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- TLP292-4(GB-TP,E(T
- Electronic Component
- 1
- Package
- SOP-16-4.4mm
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- 3us@2mA,100Ω
- Electronic Component
- BM0084327843
- Operating Temperature
- 55℃~+125℃
- Load Voltage
- 80V
- Type
- AC,DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- Output Channel Count
- 4
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP292-4(GB-TP,E(T) 产品概述
一、产品简介
TLP292-4(GB-TP,E(T) 是一款由东芝（Toshiba）公司生产的高性能光电耦合器，旨在满足各种电子应用中对隔离和信号传输的需求。其特别设计的特性使其能在AC和DC电路中广泛应用，尤其是在需要信号隔离和电流控制的场合。
二、产品特性
隔离功能: TLP292-4提供了良好的电气隔离性能，确保信号传输过程中不会发生干扰或短路对设备造成伤害。在设计电路时，隔离功能能够有效防止高电压部分对低电压部分的影响。
光电三极管输出: 此器件内部集成了光电三极管，其输出特性提供了高灵敏度和快速响应。最大输出电流可达50mA，适合多种负载驱动。
低门限电压: TLP292-4的驱动电压低至1.25V，使其在逻辑电路及低电压应用中能有效降低功耗，并提升系统的整体效率。
封装设计: 该产品采用SOP-16封装，尺寸为4.4mm，便于集成到小型和便携设备中。SOP封装还具有良好的热性能和电气特性，确保器件在低温和高温条件下具有稳定性。
高可靠性和稳定性: 东芝在光电耦合器领域拥有丰富的经验，TLP292-4在制造过程中经过严格的质量控制，确保其具有长期的稳定性和可靠性。
三、应用场景
TLP292-4(GB-TP,E(T)的应用非常广泛，主要体现在以下几个方面：
工业自动化系统: 在自动化设备和PLC（可编程逻辑控制器）中，TLP292-4常用于信号传输和控制，确保设备之间的安全隔离。
电源管理: 适用于开关电源和电源适配器中，通过光耦合器进行反馈和调节，保证电源输出的稳定性和可靠性。
数据通信: 在需要数字信号传输的场合，TLP292-4能够有效隔离和传输数据，避免在数据处理过程中产生的噪声影响信号质量。
消费电子产品: 在家用电器和个人电子设备中，利用其小巧的封装和出色的性能，TLP292-4被广泛应用于各种控制电路中。
医疗设备: TLP292-4也适用于医疗设备中，用于隔离不同模块之间的信号，从而提高设备的安全性和性能。
四、技术参数
- 最大输出电流: 50mA
- 输入电压范围: 通常为1.25V
- 工作温度范围: -40°C至+100°C
- 封装类型: SOP-16
- 引脚数: 16
五、总结
TLP292-4(GB-TP,E(T)光电耦合器以其优越的性能和灵活的应用范围，成为现代电子设计中不可或缺的元件。无论是在工业控制、消费电子，还是在特定的医疗设备中，TLP292-4都能为系统提供安全、稳定的信号传输方案。它的低功耗、可靠性以及出色的电气性能使其成为电子工程师在设计新产品时的首选解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
