Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TLP183(-TPL,E(T TLP183
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TOSHIBA TLP183(GB-TPL, E(T
- Type
- TOSHIBA
- Unit
- Electronic Component
- Minimum package
- 3000
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- TLP183(GB-TPL,E(T
- Electronic Component
- 1
- Package
- SOP-4
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.274g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM0000288511
- Operating Temperature
- 55℃~+125℃
- Load Voltage
- 80V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- (Pd)
- 200mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP183(GB-TPL,E(T) 产品概述
产品概述
TLP183(GB-TPL,E(T) 是由东芝（Toshiba）出品的一款高性能贴片光耦合器，设计用于在电气隔离与信号传递之间提供可靠的解决方案。该光耦合器采用SOP-4封装，适合现代电子设备对空间和功耗的严格要求，广泛应用于各种电子设备及工业控制系统中。
基本参数
输入类型: DC
- TLP183支持直流输入信号，使其适合于多种控制和驱动应用中，如开关电源、电机驱动及信号隔离等。
通道数目: 1
- 本产品为单通道光耦，适合于对信号进行简单、直接的隔离，确保信号的稳定传输。
隔离电压: 3750Vrms
- TLP183 的隔离电压高达3750Vrms，提供了出色的电气隔离性能，能够有效防止输入侧的高电压对输出侧造成的影响，这对于增强系统的安全性和可靠性至关重要。
输出电压(最大): 80V
- 最大输出电压为80V，使得TLP183能在多种应用中支持不同的输出要求，满足不同设备对电压的需求。
输出电流 (Max): 50mA
- TLP183在输出端能够提供最大50mA的电流，适用于对电流有一定要求的负载，能够灵活驱动各种电子器件。
产品类型: 晶体管输出
- 作为晶体管输出光耦，TLP183能够以较低的延迟时间和良好的线性响应传递信号，适用于数据通讯及信号处理领域。
应用场景
TLP183 曝光的高性能特性，使其成为许多应用的理想选择，尤其是在工业自动化、家电、通信和汽车电子等领域。以下是一些具体的应用场景：
开关电源: 在开关电源中，TLP183可用于反馈控制环路，提供隔离的反馈信号，提高系统的稳定性和安全性。
工业控制: TLP183可以在工业控制系统中实现传感器与控制单元之间的有效信号隔离，防止信号传输过程中的干扰，提高系统的可靠性。
电机驱动: 适用于电机驱动电路中的信号隔离，保护控制电路免受高压电机侧的影响。
通信设备: 在高速数据传输系统，如 PROFINET、CAN、RS-232 等协议中，TLP183能够保证数据的完整性及信号的稳定传输。
设计优点
小型化: SOP-4 封装设计使得 TLP183 适合空间受限的应用，有助于整体产品的小型化和轻量化设计。
高效能: 该产品在高速传输方面表现优异，具有较低的输入输出延迟，能有效提升系统的响应速度。
高可靠性: 高隔离电压确保了系统的稳定性，并大幅降低了因电气故障而造成的损坏风险。
易于集成: TLP183 产品的设计理念使其方便与其他元器件集成，简化电路设计，提高了整体的系统集成度。
总结
TLP183(GB-TPL,E(T是一款具备高隔离电压、良好线性输出及适应性广泛的高性能贴片光耦合器，凭借其可靠的电气性能和出色的产品设计，能够在各种复杂应用中发挥重要作用，是现代电子产品设计中不可或缺的元件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
