WMSIC Electronic Components

SSM3K15AMFV,L3F(T SSM3K15AMFV

ModelSSM3K15AMFV,L3F(T
PackageSOT-723
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA SSM3K15AMFV, L3F(T
Type
TOSHIBA
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
SSM3K15AMFV,L3F(T
Electronic Component
1
Package
SOT-723
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0220963452
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
8000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:SSM3K15AMFV,L3F(T)

一、引言

SSM3K15AMFV,L3F(T)是一款由东芝(TOSHIBA)公司制造的N沟道MOS场效应管(MOSFET),采用SOT-723封装。MOSFET作为一种关键的电子元器件,以其高效率和高切换速度广泛应用于各种电子电路中。

二、基本特性

SSM3K15AMFV,L3F(T)的主要特点包括:

  • 类型:N沟道MOSFET
  • 封装:SOT-723,适合表面贴装(SMD)技术
  • 最大漏源电压 (V_DS):可承受高达60V的电压
  • 最大漏电流 (I_D):在较高温环境下可持续承载大约1.5A的电流
  • 开关速率:具有快速开关性能,适合高频应用

三、技术参数

  1. 工作电压和电流:

    • SSM3K15AMFV,L3F(T)的漏源电压(V_DS)可达到60V,适合多种电源应用。
    • 在额定条件下,最大漏电流(I_D)可以达到1.5A,适用于驱动各种负载。
  2. 起始门极电压(V_GS):

    • 跨越的阈值电压在2-4V之间,使其兼容各类控制电路。
  3. 热特性:

    • MOSFET的功耗特性优越,具备良好的散热能力,对于电路的稳定性至关重要。
  4. 封装特性:

    • SOT-723封装使其在小型化设计中表现优异,可以有效节省电路板空间,适合移动设备和紧凑型电子产品。

四、应用领域

SSM3K15AMFV,L3F(T)因其优越的性能,被广泛应用于多个领域,包括:

  1. 开关电源:

    • 在电源转换器和充电器中起着关键作用,可以实现高效的开关操作。
  2. 电机驱动:

    • 适用于各种直流电机和步进电机的驱动控制,帮助提高能源的利用效率。
  3. 电池管理系统:

    • 在智能手机、平板电脑等便携式设备中,常用于电池的充放电管理,确保安全性和效率。
  4. LED驱动电路:

    • 用于调节LED的亮度以及快速开关控制,从而提升照明效果与效率。

五、优势与竞争力

与同类产品相比,SSM3K15AMFV,L3F(T)具有以下优势:

  • 高效性能:较低的导通电阻,提供更好的能量转换效果。
  • 高频应用能力:具有快速的开关特性,满足现代电子产品对高频开关的需求。
  • 尺寸小巧:SOT-723封装设计使其适合各种空间受限的设备,增强了产品的设计灵活性。

六、总结

SSM3K15AMFV,L3F(T)是东芝公司推出的一款高性能N沟道MOSFET,适用于多种高效能电力和信号处理应用。凭借其优越的电气性能、小巧的封装及广泛的应用范围,该产品在市场竞争中展现出强大的吸引力和潜力。对于设计师和工程师而言,选择SSM3K15AMFV,L3F(T)作为其电路设计的元器件之一,将有助于提升整体产品性能与市场竞争力。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.