WMSIC Electronic Components

TLP184(-TPL,SE(T TLP184

ModelTLP184(GB-TPL,SE(T
PackageSMD-4P
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOSHIBA TLP184(GB-TPL, SE(T
Type
TOSHIBA
Unit
Electronic Component
Minimum package
3000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TLP184(GB-TPL,SE(T
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0g
Electronic Component
1
Electronic Component
9us
Electronic Component
BM0229324788
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
AC,DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP184 (GB-TPL, SE(T) 产品概述

一、基本信息

TLP184是由东芝(TOSHIBA)公司生产的一款高性能光耦合器,采用SOP-4封装设计。它是一种用于信号隔离和传输的电子元器件,广泛应用于工业控制、数据通讯和家用电器等领域。光耦合器是一种利用光信号传输来实现输入和输出电路电气隔离的元器件,有效地避免了高电压或噪声信号对敏感电路的干扰。

二、产品特性

  1. 高隔离电压:TLP184具备高达5000 VRMS的光隔离电压,使其在电气隔离方面表现优异。这使得它能够在高电压环境下安全地传输信号。

  2. 高速响应:该光耦合器具有较高的开关速度,通常在1 Mbps以上。这一特性使其非常适合高频信号的传输,确保了数据的实时性和准确性。

  3. 低功耗:TLP184的输入端电流需求较低,通常在几毫安级别,这样的设计有效降低了系统的功耗,适应了当前电子设计对能效的要求。

  4. 温度范围:它的工作温度范围为-40°C至+100°C,能够适应多种环境条件,保证了在各种工作环境下的可靠性。

  5. 小型封装:采用SOP-4封装设计,使得TLP184在空间有限的电路板上也能轻松安装,有效降低了整体系统的尺寸。

三、应用场景

TLP184光耦合器因其卓越的性能和可靠的技术特性,在多个领域都得到了广泛应用:

  1. 工业控制:在PLC(可编程逻辑控制器)和其他自动化设备中,TLP184常用于信号传输隔离,保护敏感的微控制器免受噪声干扰。

  2. 数据通讯:光耦合器可用于数据传输链路,例如在RS-232或RS-485通讯接口中实现电气隔离,提高系统的抗干扰能力。

  3. 电源电路:在开关电源或电池管理系统中,TLP184通过提供输入和输出之间的电气隔离,确保系统安全和稳定运行。

  4. 家用电器:在现代家电产品中,TLP184可以用于控制电机、温度传感器等部件,保护微控制器和其他敏感元器件。

  5. 医疗设备:光耦合器在医疗设备中也发挥着重要作用,特别是在需要与高压电源隔离的应用场景,如监测仪器和各种诊断设备中。

四、总结

TLP184光耦合器是东芝公司在光隔离器领域的重要产品之一,其高隔离电压、高速响应及低功耗等优良特性使其在众多应用场景中表现出色。随着工业自动化、智能家居和物联网等技术的快速发展,TLP184作为一个关键的电子元器件,在未来依然会在各类电子产品中扮演重要角色。选择TLP184,意味着选择了高可靠性和高性能的信号隔离解决方案,为设计师和工程师们提供了更大的灵活性和安全性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.