Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SV279(TPH3,F)是一款由东芝(TOSHIBA)公司生产的通用二极管,采用SOD-523封装。这款二极管设计用于低功耗电子设备,具有优良的电流和电压特性,能够广泛应用于各种电子电路中,如整流、信号调节以及保护电路等。其高效能和小型化设计使其在现代电子产品中表现出色。
SOD-523封装是一种表面贴装(SMD)封装形式,其尺寸小巧,便于在空间有限的电路板上安装,特别适合于手持设备和小型电子设备的设计。SOD-523的具体尺寸为1.6mm x 0.8mm x 0.6mm,符合RoHS标准,环保性能良好,适合于高密度的电路设计。其引脚设计有助于实现更好的热管理和电性能,确保器件在高频应用中的稳定性。
1SV279(TPH3,F)具有较低的正向压降和较高的逆向击穿电压,使其能够在多种应用条件下保持优异的性能。其主要电气参数如下:
这些电气特性使得1SV279(TPH3,F)能够在高效能和低功耗的场合广泛应用。
1SV279(TPH3,F)的应用领域非常广泛,主要包括但不限于以下几个方面:
1SV279(TPH3,F)所具备的优势使其在设计中成为了一种理想选择:
综上所述,1SV279(TPH3,F)是一款出色的通用二极管,具有优良的电气性能和广泛的应用场景,适合各种低功耗电子设备。其小型化的封装使其在现代电子产品设计中尤为重要,能够为设计工程师提供解决方案,满足高效能和高密度电路设计的需求。选择1SV279(TPH3,F),将为您的项目增添更多的可能性与可靠性。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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