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1SS374(TE85L,F) 1SS374
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TOSHIBA 1SS374(TE85L, F)
- Type
- TOSHIBA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- 1SS374(TE85L,F)
- Electronic Component
- 1
- Package
- TO-236-3
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0263668284
- Current
- 100mA
- Diode
- 1
- Current(Ir)
- 20uA@10V
- (Vf)
- 500mV@100mA
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 10V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SS374 (TE85L,F) 产品概述
一、产品简介
1SS374 (TE85L,F) 为东芝（TOSHIBA）生产的肖特基整流二极管，采用一对串联式设计，针对低压、小电流的整流与保护应用优化。肖特基结构带来低正向压降与快速响应，适合便携与低功耗电路。
二、主要电气参数
- 二极管配置：1对串联式
- 正向压降：Vf = 0.5 V @ 100 mA（单颗）
- 直流反向耐压：Vr = 10 V（单颗）
- 最大整流电流：ID = 100 mA（直流）
- 反向电流：Ir = 20 μA @ 10 V
- 非重复峰值浪涌电流：Ifsm = 1 A（单次浪涌）
以上参数表明器件在低压（<10 V）和小电流工况下具有良好效率与可靠性。
三、封装与机械特性
封装：TO-236-3（常见SOT-23类小信号封装），体积小、适合贴片组装。串联配置可在同一封装内实现更高耐压或用于电压叠加设计，便于节省PCB空间。
四、典型应用场景
- 便携设备的低压整流与电源后级保护
- 功率路径上的极性保护与反接保护
- 信号钳位、检波与电平移位电路
- 通信与传感模块的小电流整流场合
五、使用建议与注意事项
- 直流工作电流建议不超过100 mA，长期高温下应适当留有余量以延长寿命。
- 非重复浪涌能承受1 A，但不可作为频繁大电流回路使用，注意浪涌脉冲能量和重复率。
- 肖特基器件在高温时反向泄漏电流会显著上升，设计时应考虑工作温度对Ir的影响。
- 串联配置在设计时注意总正向压降与总反向耐压（串联后耐压可叠加），并确保每颗器件工作均衡。
六、封装布局与散热提示
采用短且宽的走线连接引脚以减少寄生阻抗，必要时在焊盘下方增加铜箔散热区。对于靠近热源或工作在较高平均功率的场合，应评估封装温升并考虑外部散热或降低电流密度。
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