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CRS11(TE85L,Q,M) CRS11
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TOSHIBA CRS11(TE85L, Q, M)
- Type
- TOSHIBA
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- CRS11(TE85L,Q,M)
- Electronic Component
- 1
- Package
- SOD-123F
- Electronic Component
- Schottky Diode
- Electronic Component
- 2.19g
- Electronic Component
- 1
- Electronic Component
- BM0230030344
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 1.5mA@30V
- (Vf)
- 360mV@1A
- Electronic Component
- 40℃~+125℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CRS11 (TE85L,Q,M) 产品概述
一、概述
CRS11（标识 TE85L,Q,M）为东芝（TOSHIBA）出品的一款肖特基势垒二极管，面向表面贴装应用。该器件采用 SOD-123F（S‑FLAT，1.6×3.5mm）小型封装，具有低正向压降和较高浪涌能力，适合空间受限的开关电源与功率整流场合。
二、主要电气参数
- 正向压降（Vf）：360mV @ 1A
- 直流反向耐压（Vr）：30V
- 额定整流电流：1A（连续）
- 反向电流（Ir）：1.5mA @ 30V
- 非重复峰值浪涌电流（Ifsm）：20A
- 工作结温范围：-40℃ ～ +125℃
三、封装与机械特性
器件采用 SOD-123F（S‑FLAT）表面贴装封装，外形尺寸紧凑（约 1.6×3.5mm），利于高密度 PCB 布局与自动化贴装。封装有利于热传导至 PCB 铜箔，便于散热设计。
四、主要特性与优势
- 低正向压降（0.36V @1A），减小导通损耗，提高系统效率；
- 30V 反向耐压适用于 5V/12V 低压电源整流与保护；
- 20A 峰值浪涌能力，能承受启动或短时浪涌电流；
- 小型表贴封装，适合紧凑型电源模块与便携设备；
- 工作温度范围宽，适应多种工业与消费级环境。
五、典型应用场景
- 开关电源整流、输出二极管；
- 反向保护与续流二极管（freewheeling）；
- 电池充放电路径保护与反向防护；
- USB 电源、车载电子、便携式设备的低压快恢复整流。
六、使用与可靠性建议
- 由于反向漏电在 30V 时可达 1.5mA，设计时需评估泄漏对系统待机损耗的影响；
- 在高平均电流或散热受限场合，建议在 PCB 上扩大热铜面积以降低结温；
- 遵循标准回流焊工艺进行贴装，避免超出器件最大结温；
- 对于频繁大幅浪涌或更高电压场景，应选用更高 Vr 或更大 Ifsm 的型号。
七、采购与替代件
CRS11 属于东芝品牌产品，适合量产和替换设计。若需更高耐压或更低漏电，可考虑同类厂商的 40V/60V 肖特基或低漏型肖特基替代件，替换时请核对正向压降、反向电流和封装兼容性。
如需详细数据表、典型特性曲线或封装尺寸图，可提供进一步索取链接或 PDF 数据手册以便设计验证。
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