WMSIC Electronic Components

TC7SZ17FU,LJ(CT TC7SZ17FU

ModelTC7SZ17FU,LJ(CT
PackageSOT-25-5
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TC7SZ17FU, LJ(CT
Type
TOSHIBA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TC7SZ17FU,LJ(CT
Electronic Component
1
Package
SOT-25-5
Electronic Component
Buffers / Drivers / Transceivers
Electronic Component
0g
Electronic Component
1
Electronic Component
1
Electronic Component
BM0230006830
Type
Surface Mount
Operating Temperature
40°C ~ 85°C(TA)
Type
Flip-Flop
Output Type
Electronic Component
Logic Type
Buffer
Package / Housing
5-TSSOP,SC-70-5,SOT-353

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC7SZ17FU,LJ(CT) 产品概述

一、简介

TC7SZ17FU,LJ(CT) 是东芝(TOSHIBA)推出的一款单路非反向缓冲器/驱动器,输入采用施密特触发器(Schmitt),输出为推挽式结构。器件工作电源范围宽(1.65V 至 5.5V),工作温度范围为 -40°C 至 85°C(TA),适合多种低电压数位系统中作为信号整形与驱动单元使用。封装形式包含 SOT-25-5(也常见于 5-TSSOP、SC-70-5、SOT-353 等),适用于表面贴装工艺。

二、主要特性

  • 逻辑类型:缓冲器,非反向输出,单路单位元件(1 位)。
  • 输入类型:施密特触发器,具有迟滞特性,可抑制输入毛刺与噪声,提高信号可靠性。
  • 输出类型:推挽输出,具备强驱动能力,输出高、低电流均为 32 mA(源/汇流能力)。
  • 电源电压:1.65 V 至 5.5 V,兼容多种电平体系。
  • 工作温度:-40°C 至 +85°C,满足工业级要求。
  • 封装:SOT-25-5(供应商器件封装 USV),适合紧凑布局与自动贴装生产。

三、典型应用

  • 逻辑电平整形与缓冲,特别是在长走线或噪声较大环境下使用施密特输入以提高信号完整性。
  • 驱动小型继电器线圈、LED(受限于电流与功耗)、或作为总线驱动器为后级器件提供足够的驱动能力。
  • 低功耗移动设备、传感器接口以及 1.8V/3.3V 混合电压系统中的电平隔离与缓冲。

四、使用建议与注意事项

  • 输出驱动能力为 32 mA,设计时应注意功耗与器件热限,避免长时间大电流工作导致过热;在高频切换或重负载情况下推荐进行热仿真或实测。
  • 施密特输入对噪声抑制有效,但输入端仍建议加上适当的上拉/下拉电阻或滤波网络以稳定静态电平。
  • 在不同电压域接口时,保证供电电压与外部器件兼容;若需在更高电压下驱动更大负载,应使用外部功率级驱动器。
  • 串联阻抗(阻容匹配)与 PCB 布线:短而粗的走线、靠近器件的去耦电容(例如 0.1 µF)可降低电源噪声与振铃,提高信号完整性。

五、封装与焊接建议

  • SOT-25-5 与其他小型封装适合高密度布板,焊接时注意回流曲线与焊盘设计,遵循东芝推荐焊盘与焊接工艺以保证可靠性。
  • 贴片前后应避免超出器件最大应力,储存与回流温度控制在制造商规范范围内,防潮处理按级别执行。

以上为 TC7SZ17FU,LJ(CT) 的概述与实用建议。若需更详细的电气特性曲线、时序参数或参考电路图,可提供数据手册(datasheet)以便进一步分析与设计指导。

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