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TLP183(GR-TPL,E(T TLP183
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TOSHIBA TLP183(GR-TPL, E(T
- Type
- TOSHIBA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- TLP183(GR-TPL,E(T
- Electronic Component
- 1
- Package
- SOP-4
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM0266106772
- Operating Temperature
- 55℃~+125℃
- Load Voltage
- 80V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- (Pd)
- 200mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP183（东芝）产品概述
一、产品简介
TLP183 是东芝推出的一款单通道光电耦合器（SMD、SOP-4 封装），输入为直流 LED，输出为光电三极管。器件提供最高 3.75 kVrms 的隔离耐压，适合在信号隔离、接口隔离与低功率开关场合替代直接耦合。主要额定参数包括：正向压降 Vf≈1.25V、最大正向电流 If≤50mA、集电极电流 IC（或输出电流）可达 50mA，负载电压可承受至 80V；直流反向耐压 Vr≈5V。典型开关速度：上升时间 tr≈2µs、下降时间 tf≈3µs，工作温度范围 −55℃～+125℃。
二、关键性能亮点
- 隔离强度高：3.75kVrms 绝缘等级，适合工业与开关电源等对安全与噪声隔离有要求的场合。
- 宽 CTR 范围：电流传输比 CTR 在 100%～600% 之间（说明在一定 IF 下可获得较大的输出）；实际设计中按最小 CTR 100% 保守估计。
- 低饱和压：VCE(sat)≈0.3V（典型条件下，如 IF≈2.4mA、IC≈8mA），有利于降低输出压降与功耗。
- 中高速响应：µs级开关特性，适用于大多数数字信号隔离（带宽可达数十至数百 kHz 级别）。
三、典型应用场景
- 单片机与大电流、噪声电路隔离的数字接口。
- 开关电源控制与反馈隔离（非高频 PWM 驱动）。
- 工业控制信号传输、继电器驱动前端隔离。
- 测试测量仪器、通信设备的电气隔离单元。
四、设计与使用建议
- 驱动 LED 时按公式 R = (Vin − Vf) / If 选择限流电阻；若以 1–5mA 驱动常可兼顾速度与寿命，必要时可提升至数十 mA，但不超过 50mA 峰值。
- 输出侧选取上拉电阻应考虑目标 Ic 与 VCE(sat)：例如 Vcc=5V、IC≈8mA 时 R≈(5−0.3)/8mA≈590Ω。为降低功耗与发热，可在满足响应及电平要求下增大 R。
- 总功耗 Pd≈200mW，应注意器件功耗分布并保证 PCB 散热与限流，避免长期在高 If/高 Ic 条件下工作。
- 版图与隔离距离：遵循绝缘爬电距离与穿越孔处理，SMD 布局时保持输入/输出地线分离并考虑清洁电镀与阻焊间距。
五、可靠性与封装
SOP-4 表面贴装封装利于自动贴装与回流焊工艺，适合批量生产。工作温度范围宽（−55℃～125℃），适应工业级环境。为保证长期可靠性，建议遵循制造商关于回流温度曲线与焊接工艺的限制，并避免长时间超额定电流或靠近热源布置。
总结：TLP183 以其高隔离电压、较宽 CTR、µs 级响应及 SOP-4 的封装形态，适合在工业控制、接口隔离与电源反馈等场合做安全、低成本的光电隔离解决方案。设计时重点关注输入限流、输出负载及器件散热与 PCB 隔离，实现稳定可靠的隔离传输。
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