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TLP2348(TPL,E(T TLP2348
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TOSHIBA TLP2348(TPL, E(T
- Type
- TOSHIBA
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- TLP2348(TPL,E(T
- Electronic Component
- 1
- Package
- SOP-5-3.6mm
- Electronic Component
- Logic Output Optocoupler
- Electronic Component
- 0g
- Electronic Component
- 1
- Channel Count
- 1
- CMTI(kV/us)
- 50kV/us
- Electronic Component
- BM0234624868
- Operating Temperature
- 40℃~+110℃
- Operating Voltage
- 4.5V~30V
- Type
- DC
- Output Current
- 50mA
- (Vf)
- 1.55V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP2348 贴片光耦产品概述
一、产品简介
TLP2348（东芝 TOSHIBA）是一款单通道高速、低功耗的隔离式光耦合器，采用SOP-5（3.6mm）贴片封装，面向工业控制与信号隔离场景。器件输入为直流激励，输出侧为开路集电极或推挽型（根据具体引脚配置），在4.5V~30V的工作电压范围内可稳定工作，提供高达3.75kVrms的输入-输出隔离耐压，适合需要高安全隔离与抗干扰能力的系统设计。
二、主要特性
- 隔离电压（Vrms）：3.75kV，满足常见工业隔离等级要求。
- 共模瞬变抗扰度（CMTI）：50kV/µs，适用于高dv/dt环境下的差模噪声抑制。
- 通道数：1通道，便于单点隔离设计与布线。
- 工作温度：-40℃至+110℃，适合严苛环境。
- 封装：SOP-5（3.6mm），便于SMT工艺与空间受限的PCB布局。
三、电气性能与参数说明
- 传播延迟：tpLH、tpHL 均约120ns，适合数百kHz以内的信号隔离与传输。
- 输入阈值电流（FH）：约1.6mA（触发电流），实际设计中通常以If=~10mA驱动LED以保证充足的开关裕量。
- 正向电压（Vf）：典型值约1.55V（If=10mA）；反向耐压（Vr）：5V。
- 输出电流：可承受50mA，适用于驱动中小功率负载或作为开关信号源。
- 功耗（Pd）：约100mW，需在PCB热设计中考虑功耗分散与散热。
四、典型应用场景
- 工业控制信号隔离（PLC输入/输出隔离、传感器隔离）。
- 电源管理与DC-DC模块控制信号隔离。
- 高频开关环境下的逻辑隔离与干扰抑制。
- 人机界面与数据采集系统中，提供安全的低电压侧与高电压侧隔离。
五、封装与可靠性
SOP-5（3.6mm）表面贴装封装，适合自动化贴装与回流焊工艺。东芝品牌器件具有稳定的制造与质量控制，器件额定工作温度宽、抗振动与长期可靠性良好，适用于长期运行的工业设备。
六、设计注意事项
- 输入端需串联限流电阻，根据驱动电压与Vf（1.55V）计算，使If接近设计值（推荐10mA左右）以保证响应速度与寿命。
- 输出侧在不同工作电压（4.5V~30V）下应选择合适拉电阻或上拉电源，确保输出电流不超过50mA且器件功耗Pd ≤100mW。
- 在高温环境下注意参数漂移与失效率上升，必要时进行降额设计。
- 对于高隔离要求，PCB要保证足够的爬电距离和对地绝缘，避免局部放电。
- 传播延迟约120ns，适合多数控制与测量用途，但在亚微秒级精确时序系统需提前评估时延匹配。
总结：TLP2348以其高隔离电压、优异的共模瞬变抑制（50kV/µs）和宽工作电压范围（4.5–30V），适合各种工业与电源隔离应用。在实际设计中，通过合理选择驱动电流、热管理与PCB绝缘布局，可发挥其稳定可靠的信号隔离能力。
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