WMSIC Electronic Components

TB67H450FNG(O,EL) TB67H450FNG

ModelTB67H450FNG(O,EL)
PackageSOP-8
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TB67H450FNG(O, EL)
Type
TOSHIBA
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TB67H450FNG(O,EL)
Electronic Component
1
Package
SOP-8
Electronic Component
Brushed DC Motor Driver IC
Electronic Component
0.227g
Electronic Component
1
Integrated FET
Electronic Component
H
1
Features
Current Sampling
Electronic Component
BM0229279210
Resistor
600mΩ
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~44V
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TB67H450FNG(O,EL) 产品概述

一、概述

TB67H450FNG(O,EL) 为东芝(TOSHIBA)推出的单通道 H 桥驱动器,封装为 SOP-8,内部集成功率 FET,适用于中小功率直流电机和线性致动器驱动场景。工作电压范围宽(4.5V 至 44V),能够在较大输入电压范围内稳定工作,最高输出持续电流等级为 3A,适配多种嵌入式和工业应用。

二、主要电气参数

  • 集成FET:是(内部集成功率场效应管,简化外部功率器件设计)
  • H 桥数量:1(单通道双向驱动)
  • 输出电流:3A(额定输出能力)
  • 工作电压:4.5V ~ 44V(宽电压输入,适应多种供电方案)
  • 导通电阻(RDS(on)):600 mΩ(影响功耗与发热)
  • 静态电流(Iq):1 μA(待机功耗低,有利于电池供电系统)
  • 工作温度:-40 ℃ ~ +85 ℃(工业级温度范围)
  • 封装:SOP-8(贴片封装,便于 PCB 布局与自动化组装)

三、典型应用场景

适合驱动小型直流电机、步进电机低速档位、微型泵、风扇、打印机构件、家电面板中的执行器以及便携式和工业控制设备中要求双向驱动的场合。由于静态电流低,也适用于以电池供电、待机时间要求长的产品。

四、设计与使用建议

  • 电源去耦:在器件电源引脚附近放置合适容值的高频陶瓷与钽电容,抑制瞬态电压尖峰。
  • 保护措施:在有较强电感负载(如电机)时,应在输入端添加 TVS 或浪涌抑制,必要时在 PCB 布局中考虑增加滤波网络。
  • 散热与布局:RDS(on) 为 600 mΩ,在高电流工作时会产生显著功耗,建议留出足够铜箔面积作为散热路径,避免连续满载运行超温。
  • 驱动与控制:参考东芝官方数据手册中推荐的输入驱动时序与上升/下降斜率控制,确保 H 桥开关转换期间的稳定与安全。

五、注意事项

  • 本概述基于给定基础参数进行整理,具体保护特性(如欠压/过热/限流行为)与引脚定义、时序请以东芝官方数据手册为准。
  • 在实际设计中,应进行热仿真和电磁兼容验证,确保在目标应用的工作循环和环境温度下满足可靠性要求。

若需,我可以帮助检索并解析官方数据手册要点,或者根据您的电源与负载条件给出 PCB 布局与散热设计建议。

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