Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TLP184(V4GBTL,SE(T TLP184
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TOSHIBA TLP184(V4GBTL, SE(T
- Type
- TOSHIBA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- TLP184(V4GBTL,SE(T
- Electronic Component
- 1
- Package
- SOP-4
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM0229933812
- Operating Temperature
- 55℃~+110℃
- Load Voltage
- 80V
- Type
- AC,DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- Output Channel Count
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP184 (V4GBTL, SE(T) — 晶体管输出光耦产品概述
一、产品定位与核心特性
TLP184 是东芝推出的一款单通道晶体管输出光耦（SOP-4 封装），用于电气隔离与逻辑/模拟信号传输。器件输入可接受 AC/DC 激励（需按电路方式处理交流半波），输出为光电三极管，具备高隔离电压（Vrms 3.75 kV）与较宽的工作温度范围（-55℃ 至 +110℃），适合工业及电源等场合的隔离需求。
二、主要电气参数（典型/保证）
- LED 正向压降 Vf ≈ 1.25 V（典型值），单端输入，额定正向电流 If 可达 50 mA（注意为最大值，使用时应按数据手册和热限降额）。
- 输出耐压（VCEO）或负载电压可达 80 V，输出通道数：1。
- 输出电流能力：最高 50 mA（器件极限，应在安全余量内使用）。
- 集射极饱和电压 VCE(sat) ≤ 300 mV（典型测量条件下：IC=2.4 mA，IF=8 mA）。
- 电流传输比 CTR 范围较宽，保证最小 50%，上限可达 600%，在不同 If、IC 条件下变化明显。
- 开关速度：上升时间 tr ≈ 2 μs，下降时间 tf ≈ 3 μs，适合中等速率信号隔离。
三、功能与应用场景
TLP184 以光耦三极管输出实现电位与共模隔离，适用场景包括开关电源反馈、微控制器与高压侧接口、工业控制信号隔离、通信线路保护、家电与电源管理系统中的低速/中速隔离。其高隔离电压与宽温度特性使其在要求安全和稳定的环境中可靠性较高。
四、典型电路与设计要点
- 输入端：LED 前串接限流电阻；若接交流信号，须采取整流或双向驱动拓扑，以保护 LED。
- 输出端：光电三极管常作为开集电极使用，需外接上拉电阻至所需逻辑电平。根据所需输出电流与响应速度平衡上拉阻值。
- 设计注意：CTR 变化范围大，实际设计应依据最小 CTR 值留有裕量；避免长期在 If 接近 50 mA 的条件下工作以防热应力。考虑隔离爬电距离、封装热阻与 PCB 布局。
五、封装与选型建议
SOP-4 表面贴装，四引脚标准封装，便于自动贴装与密集布线。选型时结合响应速度、CTR 最小值及 VCEO 要求；若需更快开关或逻辑兼容推挽输出，可考虑光耦带整形或晶体管阵列型替代件。最终设计前，请以东芝官方数据手册为准，核对引脚排列与极限参数。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
