WMSIC Electronic Components

TC7SH00FU,LJ(CT TC7SH00FU

ModelTC7SH00FU,LJ(CT
PackageSOT-353
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOSHIBA TC7SH00FU, LJ(CT
Type
TOSHIBA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TC7SH00FU,LJ(CT
Electronic Component
1
Package
SOT-353
Electronic Component
Logic Gate
Electronic Component
TC7SH
Electronic Component
0.028g
Electronic Component
1
Channel Count
1
Features
Electronic Component
Electronic Component
BM69419276
Operating Temperature
40℃~+85℃
Operating Voltage
2V~5.5V
Logic Type
and Gate

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC7SH00FU,LJ(CT) 是一款由东芝(TOSHIBA)生产的高性能与非门集成电路,其设计旨在满足现代电子设备对信号处理高效性与可靠性的要求。作为一款表面贴装型(SMD)设备,它非常适合于高密度PCB(印刷电路板)应用,广泛用于消费电子、通信设备以及工业控制系统等多个领域。

产品特性

  1. 逻辑类型:TC7SH00FU 是一个1通道的与非门,具有两个输入端。这种逻辑门的输出只有在所有输入为高电平时才为低电平,方便与其他逻辑电路进行组合,从而实现更复杂的逻辑功能。

  2. 电压供电范围:该逻辑门支持的供电电压从2V到5.5V,使得其在不同电源环境下具有良好的适应性,使产品能够兼容旧有设备和新型设备的设计需求。

  3. 输入/输出特性:TC7SH00FU 的输入逻辑电平范围包括高电平(≥1.5V)及低电平(≤0.5V),在应用中能确保良好的逻辑识别精度。其输出能力为高电流和低电流各8mA,能够驱动多种负载,适合多样化的电路设计需求。

  4. 最大传播延迟:在最大负载情况下(即CL为50pF,供电电压为5V),TC7SH00FU 的最大传播延迟为7.5ns。低延迟特性对高速数字电路尤为重要,为信号传输和处理提供了高效能。

  5. 低功耗:该元件具有极低的静态电流(最大值为2µA),这对于便携式和电池供电的设备来说尤其重要,能够有效延长设备的使用寿命。

  6. 操作温度范围:TC7SH00FU 可在-40°C到85°C的温度范围内稳定工作,具备良好的环境适应性,能够在多种极端工作条件下保证长期可靠性。

应用场景

由于以上特性,TC7SH00FU,LJ(CT) 适用于多种电路设计,包括但不限于以下应用:

  • 数字信号处理:可用作基本的逻辑单元,在计算模块、数据传输以及控制系统中增加逻辑功能。
  • 接口电路:在I/O接口中作为信号反相器,能够对信号进行必要的转换与整形,确保数据的一致性与稳定性。
  • 通讯设备:在无线设备和网络通讯设备中,用于信号处理和数据线缆的逻辑控制,保证高速信号传输的稳定性。
  • 工业控制:用于自动化设备的控制逻辑,处理传感器信号,实现开关控制及状态指示。

封装与安装

TC7SH00FU 使用的 USV 封装设计专为表面贴装技术(SMT)优化,使安装更为便捷,适合于自动化贴片生产线。较小的封装尺寸也有助于节省PCB空间,提供更高的集成度。

结论

TC7SH00FU,LJ(CT) 是一款性能优良且应用广泛的与非门集成电路。其低功耗、低延迟和宽供电范围等优点使其成为现代电子设计中不可或缺的重要元器件。无论是在消费电子产品还是工业控制系统中,TC7SH00FU都能为设计师提供高效的解决方案,助力实现智能化、节能的产品效果。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.