WMSIC Electronic Components

TLP184(GR-TPL,SE(T TLP184

ModelTLP184(GR-TPL,SE(T
PackageSOP-4-2.54mm
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOSHIBA TLP184(GR-TPL, SE(T
Type
TOSHIBA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TLP184(GR-TPL,SE(T
Electronic Component
1
Package
SOP-4-2.54mm
Electronic Component
Transistor Output Optocoupler
Electronic Component
0g
Electronic Component
1
Electronic Component
3us@2mA,100Ω
Electronic Component
BM0229985832
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
AC,DC
Output Current
50mA
Output Type
Photoelectric Transistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP184(GR-TPL / SE(T))晶体管输出光电耦合器 产品概述

一、产品简介

TLP184 是东芝(TOSHIBA)推出的一款单通道晶体管输出光电耦合器,输入可接受 AC 或 DC 驱动,输出为光耦合的 NPN 光电三极管。器件面向信号隔离与逻辑接口场合,兼顾低饱和压降与较快的开关响应,适合对隔离电压与可靠性有较高要求的工业与消费电子应用。

二、主要性能与特点

  • 输入:支持 AC、DC 驱动,LED 正向压降典型值 Vf ≈ 1.25V;需按实际驱动电流选择限流元件。
  • 输出:光电三极管,最大负载电压可达 80V,允许的输出电流额定值 50mA(集电极电流)。
  • 隔离能力:典型隔离耐压 Vrms = 3.75kV(绝缘与安全隔离场合可提供良好电气隔离)。
  • 开关特性:上升时间 tr = 2µs、下降时间 tf = 3µs(测试条件 IF=2mA,RL=100Ω),满足中速信号隔离需求。
  • 饱和特性:集—射极饱和电压 VCE(sat) 典型值 300mV(测试条件标注于规格书:2.4mA, 8mA),低饱和压降有利于降低功耗和热耗散。
  • 环境与封装:工作温度范围 −55℃ 至 +110℃,封装为 SOP-4(2.54mm 引距),单通道设计便于板级布局与密度控制。
  • 品牌与可靠性:由东芝生产,适合需长期稳定工作的工业级应用。

三、典型应用

  • MCU 与高压/噪声侧之间的信号隔离(脉冲、开关信号传输)。
  • 开关电源反馈回路中的隔离检测与驱动。
  • 工业控制与PLC 输入/输出接口隔离。
  • 线路电流/电压检测、继电器驱动逻辑隔离等场合。

四、设计与使用要点

  • 输入驱动:根据所需 LED 正向电流计算串联限流电阻(R =(驱动电压 − Vf)/ If)。AC 驱动时注意 LED 反向电压限制,必要时采用整流或保护二极管。
  • 输出配置:通常以开集电极形式使用,外接上拉电阻至目标电源,选择合适阻值以兼顾开关速度与功耗;若需更快响应,可减小上拉阻值并增大驱动电流。
  • 热与电气安全:在接近 50mA 输出电流工作时注意功耗与散热;在高压侧应用时遵守绝缘和爬电距离规范,确保隔离性能。
  • 测试条件参考:在设计时参照器件规格书中给定的测试条件(如 IF、RL)来评估真实的开关时间与饱和电压表现。
  • 静电与焊接:按常规 IC 处理规范防止静电损伤,焊接温度与时间请参照东芝推荐的封装焊接曲线。

五、封装与环境适应

TLP184 提供 SOP-4 封装(引距2.54mm),便于自动化贴装与波峰/回流焊接;器件工作温度范围宽(−55℃ 至 +110℃),适应工业级温度环境。单通道小封装也利于在空间受限的 PCB 上实现隔离功能。

总结:TLP184 综合了较高的隔离耐压、可观的输出电流能力与较低的饱和压降,适合中速隔离信号传输与工业控制接口。实际设计中应严格参照规格书的测试条件进行电流、电压与热设计,确保长期稳定可靠运行。

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