Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CRZ16(TE85L,Q,M) CRZ16
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TOSHIBA CRZ16(TE85L, Q, M)
- Type
- TOSHIBA
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- CRZ16(TE85L,Q,M)
- Electronic Component
- 1
- Package
- SOD-123F
- Electronic Component
- Zener Diode
- Electronic Component
- 0.033g
- Electronic Component
- 1
- (Zzt)
- 30Ω
- Electronic Component
- BM0230030346
- Diode
- 1
- Current(Ir)
- 11uA@10V
- Power Dissipation(Pd)
- 700mW
- Electronic Component
- 14.4V~17.6V
- Electronic Component
- 40℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CRZ16(TE85L,Q,M) 产品概述
一、基本参数
CRZ16（TE85L,Q,M）为东芝（TOSHIBA）出品的稳压二极管，标称稳压值 16V，允许范围 14.4V～17.6V；最大耗散功率 Pd = 700mW；反向漏电流 Ir = 11 μA（测量点通常为 VR = 10V）；静态或小信号阻抗 Zzt = 30Ω；工作结温范围为 -40℃ ～ +150℃；封装为 SOD-123F，适合表面贴装工艺。
二、主要特性
- 额定稳压 16V，适用于中低功率的基准/稳压应用。
- 700mW 的耗散能力在 SOD-123F 小封装中属于中等水平，适合板上分流稳压或电压钳位用途。
- 较小的反向漏电（μA 级）适用于多数模拟电路，但在高阻抗测量回路中仍需考虑漏电影响。
- 动态阻抗 30Ω 提示在大电流变化时电压会有明显波动，适合对精度要求不极高的场合。
三、电气性能解析
在最大额定耗散 Pd 下的大致稳压电流 Iz_max ≈ Pd / Vz = 700mW / 16V ≈ 43.8mA。实际工作中通常选择远低于该值的工作电流以降低热耗与温漂。动态阻抗 Zzt = 30Ω 表示电流每变化 1mA 时，稳压电压将变化约 30mV（近似线性区），因此对于需要较稳定基准电压的设计应考虑更低阻抗或精密参考源。
四、功率与热管理
尽管封装允许 700mW 的耗散，但在实际电路中需考虑 PCB 散热、环境温度与结温上升。应避免长期在 Iz 接近 Iz_max 的工况下使用；设计时参考器件完整数据手册中的热阻与功率降额曲线，尽量在环境温度较低及有良好散热路径的条件下运行，以延长可靠性与稳定性。
五、典型应用
- 板上分流稳压（小电流参考/偏置）
- 电压钳位与浪涌抑制（配合限流电阻）
- 电源监控与保护电路中的参考电压源
注意：在对电压精度和温漂敏感的电路中，应评估其动态阻抗与温度特性是否满足需求。
六、封装与装配建议
SOD-123F 封装适合自动贴装与回流焊流程。焊盘布线应尽量缩短接地与电源回路路径，必要时在靠近器件处增加铜面积以改善散热。对高温回流与清洗工艺兼容性请参照东芝官方封装与可靠性规范。
七、选型与注意事项
选用前确认实际工作电流范围与允许的电压精度。若电路对稳压精度、噪声或温漂要求较高，建议考虑低阻抗或更高精度的参考源。设计中务必按数据手册核对最大结温、热阻与降额曲线，留有安全裕量。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
