Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TC7S14F,LF(T TC7S14F
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
12
specifications
Core information
- Product name
- TOSHIBA TC7S14F, LF(T
- Type
- TOSHIBA
- Minimum package
- 3000
Technical parameters
- Electronic Component
- TOSHIBA
- Electronic Component
- TC7S14F,LF(T
- Electronic Component
- 1
- Package
- SSOP-5
- Electronic Component
- Inverter
- Electronic Component
- 0.1g
- Electronic Component
- 1
- Electronic Component
- BM0265336398
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：TC7S14F,LF(T 反相器
一、产品简介
TC7S14F,LF(T) 是一款来自东芝（TOSHIBA）的低功耗 CMOS 反相器，采用 SSOP-5 封装。它是一种高性能数字集成电路，主要用于数字电路中信号的反转和逻辑运算。得益于其优良的电气特性和小巧的封装形式，TC7S14F,LF(T) 被广泛应用于便携式设备、信号处理、工业控制等领域。
二、主要特点
逻辑功能：TC7S14F,LF(T) 是一种反相器，能够有效地将输入逻辑信号进行反相处理。这使得用户可以在其电路设计中实现逻辑反转的需求。
高性能：该芯片的工作电压范围为 1.6V 到 5.5V，适合多种电源系统。此外，TC7S14F,LF(T) 在低电压下运行良好，最大消耗电流非常小，典型值为几微安（μA），这对于电池供电的设备尤为重要。
小型封装：SSOP-5 封装使得 TC7S14F,LF(T) 非常适合空间有限的电子设备。其精确的尺寸设计不仅节省了PCB板面积，还降低了信号延迟和信号干扰的可能性。
温度范围：TC7S14F,LF(T) 支持广泛的工作温度范围，从 -40°C 到 +85°C，保证了在各种环境条件下的稳定工作。
CMOS技术：该产品基于 CMOS 技术，具备高输入阻抗、低功耗及抗干扰能力等优点，相比于传统的 TTL 逻辑芯片，能够显著降低功耗和发热。
三、应用领域
TC7S14F,LF(T) 凭借其多样的特点，广泛应用于以下领域：
- 便携式设备：如移动电话、笔记本电脑等，因其低功耗和小封装特性使其成为理想选择。
- 工业控制：在各种控制系统中，用于信号的反向处理，增强可靠性与灵活性。
- 消费电子：如电视和音频设备，在音频和视频信号处理过程中，进行信号反转。
- 通信设备：在调制解调器及其他通信设备中，有效进行信号处理与转换。
四、电气特性
TC7S14F,LF(T) 的主要电气特性如下：
- 输入电压范围：Vih（高电平输入电压）和 Vil（低电平输入电压）具有明确的标准，确保逻辑高低电平的准确识别。
- 输出电流：输出能力强，能够驱动多个后级负载，确保系统协调稳定运行。
- 延迟时间：该器件具有较低的传播延迟，确保高速数据信号的稳定传输。
五、总结
总之，TC7S14F,LF(T) 是东芝推出的一款优秀的低功耗 CMOS 反相器，凭借其高性能、低功耗、小型封装等众多优点，成为现代电子设备中不可或缺的元器件之一。无论是在个人消费电子、工业控制，还是在通信领域，TC7S14F,LF(T) 都展现出了良好的应用前景和广泛的市场需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
