WMSIC Electronic Components

74VHCT04AFT(BJ) 74VHCT04AFT

Model74VHCT04AFT(BJ)
PackageTSSOP14B
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 74VHCT04AFT(BJ)
Type
TOSHIBA
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
74VHCT04AFT(BJ)
Electronic Component
1
Package
TSSOP14B
Electronic Component
Inverter
Electronic Component
74VHCT
Electronic Component
0.122g
Electronic Component
1
Channel Count
6
Features
Power Supply
Electronic Component
BM0264925933
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~5.5V
Current(IOH)
8mA
Current(IOL)
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74VHCT04AFT(BJ) 产品概述

一、产品简介

74VHCT04AFT(BJ) 是东芝(TOSHIBA)推出的一款六路反相器(Inverter)集成电路,属于 74VHCT 系列的高速 TTL 电平兼容 CMOS 器件,满足汽车电子 AEC‑Q100 可靠性规范,适用于车载及工业级严苛环境下的逻辑反转与电平接口场合。器件采用 14‑Pin TSSOP‑B 封装(散带、卷带均可供货),工作电源范围典型为 4.5V ~ 5.5V,工作温度范围 -40℃ ~ +125℃,针对 5V 工况对 TTL 电平输入直接兼容,同时在功耗、速度与驱动能力之间取得平衡。

二、主要功能与特性

  • 六路独立反相器(6‑element inverter),每路提供稳定的逻辑反相功能。
  • 汽车级 AEC‑Q100 认证,适合车载电控单元(ECU)、车身控制、传感器接口等应用。
  • 电源关断保护(power‑off protection),在 VCC 断电或低于工作阈值时,I/O 端处于高阻状态,防止互连系统在上电/下电期间发生反向供电或意外电流。
  • 低静态电流:Iq ≈ 2 μA(典型值),在静止或等待状态下具有极低的静态功耗。
  • 工作电压:VCC = 4.5V ~ 5.5V,兼容经典 5V 系统。
  • 宽工作温度:-40℃ ~ +125℃,符合汽车和工业级应用要求。

三、电气性能要点(典型/典型条件说明)

  • 通道数:6(六个独立反相单元)。
  • 输入阈值(TTL 兼容):VIH = 2.0V(High),VIL = 0.8V(Low)。适合直接与 TTL/CMOS 门电平互联。
  • 输出驱动能力:IOH / IOL = ±8 mA(驱动能力用于短线或小负载驱动,注意不可用于大功率负载)。
  • 输出电平(在 VCC = 5V 条件下):
    • VOH = 4.4V(IOH = −50 μA,近似开路/弱拉时);VOH = 3.94V(IOH = −8 mA,满载时)。
    • VOL = 100 mV(IOL = 50 μA,近似空载);VOL = 360 mV(IOL = 8 mA,满载时)。
  • 传播延迟:tpd ≈ 5.5 ns(VCC = 5V,CL = 50 pF,典型值),满足多数高速逻辑需求。
  • 静态电流(Iq):约 2 μA(典型,器件静止时),有利于低功耗设计。

(注:上述 VOH/VOL 条件说明用于帮助理解不同载荷下的电平变化,具体参考东芝正式数据手册以获取完整的电气规范与测试条件。)

四、典型应用场景

  • TTL/CMOS 电平接口:将 5V TTL 电平信号转换并驱动 5V CMOS 逻辑系统。
  • 信号反向与缓冲:用于 MCU、传感器、计时与脉冲处理电路中的反相、整形与驱动小负载。
  • 汽车电子:传感器信号处理、车身控制模块、仪表盘逻辑翻转与接口缓冲等。
  • 通用数字电路:状态指示、门控逻辑、驱动小继电器/LED(在限流情况下)等场合。

五、设计注意事项与推荐实践

  • 去耦电容:在 VCC 与 GND 之间放置 0.1 μF 陶瓷去耦电容,靠近器件引脚以抑制瞬态噪声与稳定电源。
  • 负载与驱动限制:尽管器件可提供最高约 8 mA 的源/漏电流,但不建议长期以此极限驱动大负载;对更大驱动需求应加缓冲器或功率级驱动器。
  • 上/下电序列:器件具备电源关断保护,但在多器件系统中仍应避免不受控的信号源在器件断电时驱动其输入,以减少异常电流路径。
  • 温度与散热:在高温或高开关频率下应注意 PCB 布局与散热,保证器件工作在额定环境内并满足长期可靠性。
  • ESD 与安装:在生产与装配过程中遵守 ESD 防护规程,避免静电损伤。

六、封装与订购信息

  • 品牌:TOSHIBA(东芝)。
  • 系列:74VHCT。
  • 封装:14‑Pin TSSOP‑B(散带/卷带包装可选,具体以采购目录为准)。
  • 资格:AEC‑Q100 汽车等级。
  • 型号示例:74VHCT04AFT(BJ)(具体后缀表示封装与包装样式,请以东芝正式目录或经销商数据页为准)。

七、结论

74VHCT04AFT(BJ) 在保持高速传输和 TTL 兼容输入阈值的同时,实现了低静态功耗与汽车级可靠性,适合对温度与可靠性有严格要求的车载与工业控制应用。在实际设计中,合理的去耦、负载匹配与电源管理能够充分发挥该器件的优势。如需最终电气参数、管脚排列与典型波形,请参阅东芝官方数据手册以获得完整测试条件和器件详细信息。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.